At the Fujikura booth, we showcased a mock sample of the "Micas TH6 CPO Switch," which was being publicly displayed in Japan for the first time, as part of a joint exhibit with Fujikura's MMC products.

What is CPO (Co-Packaged Optics)?
This is a next-generation packaging technology that integrates an optical engine with a switch ASIC within the same package.
In modern data centers, particularly AI data centers, the rapid expansion of bandwidth demand has led to a significant challenge in terms of increasing power consumption.
Compared to conventional methods of inserting optical modules into the front panel, CPO (Chip-on-Plate) allows for extremely short electrical wiring distances on the substrate, resulting in significantly lower power consumption and improved signal loss.

The TH6 CPO Switch, which was exhibited at our booth, was being shown in Japan for the first time, and many visitors stopped by and showed great interest in it as cutting-edge technology.

Many attendees commented that they were familiar with the term "CPO" but were seeing the actual device for the first time. A significant number of customers showed strong interest, particularly from the perspective of future bandwidth demand in AI data centers.

Furthermore, we received many specific questions that went beyond a simple technical overview, delving into implementation aspects such as the structure of the optical connection and cable configuration. In addition, many customers were learning about Micas for the first time, making this a very meaningful exhibition opportunity in terms of increasing awareness of Micas as a white-Box switch vendor.