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Qualcomm

Qualcomm

Qualcomm® is a mobile communications technology company headquartered in California, USA. Founded in San Diego in 1985, it is known for its 3G mobile phone communication technology "CDMA" and mobile chipset "Snapdragon™".
Through innovative technological development, we provide semiconductors and software for mobile, IoT, automotive, networking, voice & music, etc.

AI/Artificial Intelligence SoftwareDiscrete Board Microcomputer / Processor /DSP ModuleWireless

Main products

Dragonwing | Snapdragon for IoT and Embedded Systems

Qualcomm Dragonwing is a platform that extends the performance of Snapdragon, proven in smartphones, to IoT and embedded devices. It highly integrates CPU, GPU, NPU, connectivity, and power management, and supports Yocto Linux, Ubuntu, Android, and Windows. It is suitable for a wide range of applications, including edge AI cameras, dashcams, digital signage, AR/VR headsets, handheld terminals, and AMR/AGVs.

Main products

LPWA/LTE/5G communication module

Introducing Qualcomm's latest LTE IoT solutions.
Our product lineup ranges from the latest 5G products to conventional 4G technologies and LPWA modem solutions for IoT devices.
For more details, please see the pages of the two module vendors listed below.

Main products

Bluetooth / Wi-Fi / RFFE Filter Products

■Bluetooth classic/Bluetooth low energy

Bluetooth
• Offers a lineup of high-performance audio products, achieving a compact size and low power consumption.
- Achieving high-quality/low-latency audio data transmission with aptX adaptive.

Bluetooth Low Memory
• Lineup of low-power, compact products for IoT applications
• Bluetooth Mesh compatible

■Wi-Fi

Supports a wide range of standards including IEEE 802.11/a/b/g/n/ac/ax.
We offer solutions for consumer, IoT devices, and industrial equipment.
• Hostless products with application-specific CPU/memory integrated into the SoC
• Hosted products that support high-speed communication by utilizing the protocol stack of an external host.
• Both Wi-Fi and Bluetooth single/combo chips are available.
- Supports various host interfaces (SDIO / USB / PCIe / UART)
• Certified modules are also available in the lineup (Qualcomm Branded modules)

■RFFE Filter

RF360 Holdings was established in 2017 as a joint venture between TDK and Qualcomm, and primarily deals in SAW/BAW filters.
Currently a wholly owned subsidiary of Qualcomm, we collaborate on RF front-end product development, providing optimal solutions for various applications including mobile, IoT, and automotive.

Qualcomm (RF360) has announced the Qualcomm ultraSAW Filter, which offers a 1dB improvement in insertion loss compared to BAW filters.
Qualcomm ultraSAW technology improves cross-isolation characteristics, insertion loss, and temperature characteristics in the 600MHz to 2.7GHz band, contributing to improved power efficiency in 5G and 4G multimode mobile devices and lower costs compared to existing BAW filters.

Main products

Macnica Tracks®

In addition to finished devices that acquire data on the condition of goods during transportation and storage (location information, temperature and humidity, impact from drops, etc.), we can provide a complete solution that includes a cloud service that enables real-time monitoring and tracking in conjunction with the devices. This IoT solution leverages our expertise in communication technology. For more details on this product and service, please visit Macnica 's "Connectivity Business" page.

Main products

Product pick-up article

Manufacturer basic information

Qualcomm
company name Qualcomm
main office
location
United States San Diego
Established 1985
Number of Employees 52,000 (as of September 2025)
Company Overview See the website below
website https://www.qualcomm.com/

Contact information

Macnica FINESSE Company

Macnica Building 1, 1-6-3 Shin-Yokohama, Kohoku-ku, Yokohama 222-8561

Inquiries by Email

Inquiries by Phone

Reception: Weekdays 09:00-17:00