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YG Solutions and Yamanaka Gokin's research results on mold DX solutions using semiconductor strain sensors STREAL were presented at the Japan Society for Technology of Plasticity
(hereinafter referred to as YG Solutions) and Yamanaka Gokin Corporation (hereinafter referred to as Yamanaka Gokin) utilizing the Macnica original brand semiconductor strain sensor "STREAL" at the 76th Japan Society for Technology of Plasticity United Lecture Meeting on September 25, 2025 (Thursday). (hereinafter referred to as "YG Solutions") and Yamanaka Gokin Co.
| Presenter | YG Solutions, Mr. Kim Sooyoung and Ms. Sano Asuka Yamanaka Gokin, Mr. Kanji Ueno and Mr. Tetsuji Yagi |
| title | "Improving the lifespan of forging dies by using soft-sensing technology and data collection of die load and temperature history" |
| Research overview | In this presentation, they reported on their efforts to utilize the semiconductor strain sensor "STREAL" and YG Solutions' soft sensing technology to convert stress loads on molds into data and use it to improve their lifespan. |
Main contents
・System construction and signal device improvement for commercialization
- Development status of data processing software suitable for mold life management
・Application example of mold life management on mass production line
■ Results of application cases
Performance evaluation tests were conducted by installing this system on a mass production press, and it was confirmed that the strain history of the mold can be continuously recorded and compiled into a database. This demonstrated the possibility of applying the system to life prediction and optimization of design and molding conditions through trend analysis, similar to healthcare systems that record and analyze blood pressure and step counts.