Thermal resistance ΘJC should be used to estimate junction temperature when using a heat sink. For molded packages, if you measure the case temperature and calculate the junction temperature using the formula "TJ = Tc. + ΘJC x Pd", be aware that the junction temperature will be underestimated.

If you want to know more, please consider attending the Thermal Design Seminar (held once every 2-3 months).

(Published in March 2023)

Please feel free to ask us any questions using the inquiry form.
A person in charge of Analog Devices products will answer your question.