Product Summary
DDR4 SDRAM is a memory standard that succeeded DDR3, achieving both higher speed and lower power consumption.
Winbond offers DDR4 SDRAM utilizing its proprietary advanced 16nm process technology. This technology supports high-speed data transfer of up to 3200Mbps while achieving smaller die sizes, reduced power consumption, and improved production efficiency.
This memory solution is suitable for a wide range of applications, including industrial equipment, network equipment, and embedded devices.
Features of DDR4 SDRAM
■ Supports data transfer speeds of up to 3200Mbps
Industry-leading speed for DDR4
■ 16nm process adopted
This enables smaller die sizes, improved production efficiency, and reduced power consumption.
■ Supports high density
It is possible to incorporate higher density DRAM while maintaining the same package size.
■ Ensures stable performance even during high-speed operation.
Improved signal quality and reduced leakage current ensure stability even during high-speed operation.
DDR4 SDRAM Product Lineup
| capacity | type name | input voltage | speed | Operating temperature range | Number of silicon die layers | Kake composition | Package | status |
| 4Gb | W664GG6R | 1.2V | 2666/3200Mbps | 0℃~95℃ / -40℃~95℃ / -40℃~105℃ | SDP | 64Mbitx16 | VFBGAMore | *Consultation required |
| W664GG8R | SDP | 128Mbitx8 | VFBGAMore | *Consultation required | ||||
| 8Gb | W668GG6T | 1.2V | 2666/3200Mbps | 0℃~95℃ / -40℃~95℃ / -40℃~105℃ | SDP | 64Mbitx16 | VFBGAMore | in mass production |
| W668GG8T | SDP | 128Mbitx8 | VFBGAMore | |||||
| 16Gb |
W66AGG6T |
1.2V | 2666/3200Mbps | 0℃~95℃ / -40℃~95℃ / -40℃~105℃ | SDP | 64Mbitx16 | VFBGAMore | Mass production is scheduled to begin in April 2027. |
|
W66AGG8T |
SDP | 128Mbitx8 | VFBGAMore | Mass production is scheduled to begin in April 2027. | ||||
| 32Gb |
W66BGG6T |
1.2V | 2666/3200Mbps | 0℃~95℃ / -40℃~95℃ / -40℃~105℃ | DDP | 64Mbitx16 | VFBGAMore | Mass production is scheduled to begin in July 2027. |
|
W66BGG8T |
DDP | 128Mbitx8 | VFBGA | Mass production is scheduled to begin in July 2027. |
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