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Product Summary

ZVS Buck Switching Regulator PI33/ PI34/ PI35xx series employ unique Zero-Voltage Switching (ZVS) technology to achieve a high conversion efficiency of 98%.

The SiP (System-in-Package) is a high-density integration of control circuits, power semiconductors, and other components, enabling the configuration of high-efficiency PoL regulators that meet a variety of specifications.

The single-wire connection provides a current-sharing function, allowing interleaved operation of multiple buck regulators for high power capability, and the ZVS technology minimizes switching losses associated with conventional hard-switching buck regulators, resulting in high conversion efficiency and high The ZVS technology minimizes the switching losses that occur in conventional hard-switching step-down regulators. The high switching frequency allows the use of small external filter components for higher power density and faster transient response to input and output variations.

The ZVS regulator operates at high switching frequencies across the full range of input voltages without sacrificing efficiency. With a minimum on-time of 20ns, they are capable of step-down power conversion up to a maximum input voltage of 60V. They are available for systems with standard input voltages of 12 VIN, 24 VIN, and 48 VIN in common packages.

Product features

Wide input operating range
Nominal 12VIN (8 - 18VIN)
Nominal 24VIN (8 - 36VIN and 14 - 42VIN)
Nominal 48VIN (30 - 60VIN and 36 - 60VIN)
-40 to 125°C operating temperature range
-55 to 125°C operating temperature range
Easy to use. Short development time
Internal compensation - Few external components
No additional design or configuration required
High efficiency
>96% peak 48VIN to 12VOUT
>96% peak 24VIN to 12VOUT
>95% peak 12VIN to 5VOUT
■High efficiency performance at light and full load
Flexible and rich feature set
Parallel connection and single line current sharing
Frequency synchronization
User-adjustable soft-start and tracking
High-density packaging platform
10 x 14 x 2.5mm SiP LGA
10 x 10 x 2.5mm SiP LG

package

■High-density SiP (System‑in‑Package)
Control circuits, semiconductor switches, and other components are integrated.

<LGA SIP>10 x 14 x 2.5mm
<LG SIP> 10 x 10 x 2.5mm

efficiency

High efficiency performance at light and full loads

48VIN to 12VOUT /PI35xx / Achieve >96% peak efficiency

24VIN to 12VOUT / PI33xx / Achieve >96% peak efficiency

12VIN to 5VOUT / PI34xx / Achieve >95% peak efficiency

Circuit configuration example

Schematics with minimum required external components

External dimensions including required components

Evaluation Board

PI33xx

PI34x

For more information, please refer to this user guide.

PI33/34xx-xx_EvalBoard User Guide

PI3542/43-00-EVAL1

PI3543/45/46-00-EVAL1

For more information, please refer to this user guide.

PI35xx-xx_EvalBoard User Guide

Product lineup

PackageSize

(LGA SiP)

Vin Range 

3.3Vout

5Vout

12Vout

15Vout

10.0 x 10.0 x 2.56mm

48.0(36.0-60.0)

-

10A

9A

-

14.0 x 10.0 x 2.56mm

12.0 (8.0 - 18.0)

15A

15A

-

-

24.0 (8.0 - 36.0)

10A

10A

-

-

24.0 (11.0 - 36.0)

-

15A

-

-

24.0 (14.0 - 42.0)

22A

20A

-

-

24.0 (17.4 - 36.0)

-

-

8A

-

24.0 (20.4 - 36.0)

-

-

-

8A

48.0 (30.0 - 60.0)

22A

20A

18A

-

You can select the optimal product by selecting input voltage, output voltage, output power, package, and usage method.
Please refer to Vicor's website for details.

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