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SECORA™ Pay 40nm Technology Solutions
Infineon Technologies offers EMV* compliant payment solutions for keychains, rings, wristbands, bracelets and more. SECORA™ Pay W for Smart Payment Accessory (SPA) is a combination of EMV chip, card operating system, payment applet and even antenna on tape. As a turnkey solution, card vendors, device manufacturers, financial institutions or event operators can quickly and cost-effectively leverage fashion accessories for payment and access control.
SECORA Pay W is optimized for card manufacturers and OEMs. The product includes a unique antenna design based on Infineon's extensive semiconductor and module expertise. Combining a deep understanding of the payment ecosystem with expertise in contactless and energy efficient chip design, Infineon enables fast and secure contactless payments within 300ms.
Product Summary
Product features
- Offer your customers payment cards with cutting-edge features, high levels of security, and a range of solutions, while enabling quick and easy creation of cards.
- Innovate with new solutions. Enables multi-application usage requiring a plug-and-play packaging solution with flexible inlay technology.
- Meet customer demands for sustainable new materials and form factors that can be integrated into virtually any material.
- Delivering new value-added use cases through innovative technologies such as NFC tags on payment cards.
advantage
One-stop solution for faster time to market
The SECORA™ Pay solution with CoM (Coil on Module) clearly defined Infineon's product responsibilities
A complete single source solution.
・SECORA™ Pay can be easily adapted to different projects and market requirements.
Easy and efficient dual interface card creation
・The SECORA™ Pay solution is based on inductive coupling technology, allowing payment and
We can help you create robust DIF cards for multi-application programs.
・Enables efficient and cost-optimized production (including consumables) and complies with the latest performance demands.
より高い投資収益率を備えたイノベーションのための最大の柔軟性
・SECORA™ Pay provides value-added services for new use cases in combination with NFC tags that ensure innovative ROI.
・SECORA™ Pay W, based on SPA (Smart Payment Accessory), provides the foundation for an innovative new form factor.
CoM packaging enables customers to take new market trends from prototype to industrialization
(metal cards, LED cards, wooden cards, eco-friendly cards, etc.).
Excellent customer support including extensive partner network
・Based on our deep knowledge of hardware, software and packaging technology, Infineon
We support SECORA™ Pay system products.
Inquiry
If you have any questions about this product or would like a quote, please contact us using the form below.
Overview of SECORA™ Pay S
| Operating System | Java Card 3.0.4, Global Platform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 |
| Type A, T=0 | |
| Memory for user applets and user data | 16KB |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Contact and dual-interface package options* | Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork-based scheme approval |
| S-COM8.6: 8-pin gold and palladium | |
| S-COM8.4: 6-pin gold and palladium | |
| Flip chip packages for robust contact card production | |
| S-MFC6.6: 6-pin gold and palladium | |
| S-MFC6.8: 8-pin gold and palladium | |
| *Pure contactless and other packaging options on request | |
| Complementary 2/3rd wire antenna design optimized for 4th line embossing | Standard CoM antenna sheets (white and transparent) |
| Holofoil and colored CoM antenna sheets (PVC from standard supplier matching customer color requirements) | |
| Available and certified Infineon reference EMV applets | Visa |
| MasterCard | |
| American Express and Discover. |
Overview of SECORA™ Pay X
| Operating System | Java Card 3.0.4, Global Platform 2.2.1 |
| Interfaces and protocols | ISO 7816, ISO 14443 |
| Type A, T=0 | |
| Memory for user applets and user data | Up to 190 KB SOLID FLASH™ NVM as platform-only configuration without any reference applets (Pay X) |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Contact and dual-interface package options* | Coil on Module packaging (based on inductive coupling) for easy and efficient dual-interface card production and easy, paperwork-based scheme approval |
| S-COM8.6: 8-pin gold and palladium | |
| S-COM8.4: 6-pin gold and palladium | |
| Flip chip packages for robust contact card production | |
| S-MFC6.6: 6-pin gold and palladium | |
| S-MFC6.8: 8-pin gold and palladium | |
| *Pure contactless and other packaging options on request | |
| Complementary 2/3rd wire antenna design optimized for 4th line embossing | Standard CoM antenna sheets (white and transparent) |
| Holofoil and colored CoM antenna sheets (PVC from standard supplier matching customer color requirements) | |
| Available and certified Infineon reference EMV applets | Visa |
| MasterCard | |
| American Express | |
| Discover | |
| Other optional applications | CIPURSE™ Applet |
Overview of SECORA ™ Pay W
| Operating System | Java Card 3.0.4, Global Platform 2.2.1 |
| Interfaces and protocols | ISO 14443 |
| Type A | |
| Memory for user applets and user data | 16KB |
| Cryptography | SDA/DDA/CDA (RSA, 3DES, SHA1, AES) |
| Dual-interface package options | MCC8 |
| SPA | |
| Wire antenna design | • SPA: antenna design included in delivery package |
| • MCC8: antenna design will be tailored to customer needs | |
| Available and certified Infineon reference EMV applets | Visa |
| MasterCard | |
| Other optional applications | CIPURSE™ Applet |
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