Product overview of heat countermeasure parts
The features of Wurth's heat countermeasure parts are that they have a rich lineup, have proven and reliable high performance, and are of high quality, as well as stable supply and good availability.
The items on this page are only examples, and there are many other lineups.
Lineup of heat countermeasure parts
Achieving high thermal conductivity using graphite Hybrid Solutions: WE-TGFG series
■ Overview
・Thermal conductivity: 400 W/(m ・ K)
・Electrical insulation: 1kV/mm
・ Hybrid Solutions: Applicable as Gap Filler and Heat Spreader
・Standard lineup includes thicknesses from 2 to 25 mm that can be applied to a wide range of applications.
・Size, shape, etc. can be customized
・Replacement with conventional silicone filler for heat dissipation
■ Usage example
Even if the space between the IC and the case is narrow and it is not possible to place a heat sink on top of the IC, WE-TGFG can accommodate this. Heat can be spread from the IC to the case or heat sink.
WE-TGFG can also be customized to fit housings of various shapes.
Heat Spreader to spread heat
■ Overview
Graphite sheet with very high thermal conductivity (1800W/mk). Paste it on the housing etc. to diffuse the local heat of the device. By using it together with Gap filler, you can achieve more effective heat countermeasures. There is also a gasket type that can be used when a non-flat thermal conductive material is required or when a non-silicon gap filler is required.
■ Usage example
The above figure is an example of the combination of Heat Spreader and Gap Filler. It is used in the form shown above between the IC and the case or heat sink. We can customize the size, shape, adhesive, etc. Please feel free to contact us.
Gap Filler to lower thermal resistance
■ Overview
Silicon-based thermal conductive sheet. Thermal resistance is lowered by filling the gap between the heat-generating device and the heat sink or housing. There are four series with different thermal conductivity and strength, and there is also Phase change material (PCM), which can be used as a substitute for liquid materials and becomes gel-like when the temperature rises.
■ Usage example
Gap Filler usage example
The above figure is an example of using Gap Filler. It is used in the form shown above between the IC and the case or heat sink. We can customize the size, shape, adhesive, etc. Please feel free to contact us.
Basic video of heat countermeasures using thermal conductive sheets
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