・Thermal conductivity: 400 W/(m ・ K)

・Electrical insulation: 1kV/mm

・ Hybrid Solutions: Applicable as Gap Filler and Heat Spreader​

・Standard lineup includes thicknesses from 2 to 25 mm that can be applied to a wide range of applications.

・Size, shape, etc. can be customized

- Replacement of conventional heat dissipation silicone fillers

Product details are available here.

This graphite sheet boasts extremely high thermal conductivity (1800 W/mk). It can be attached to enclosures and other surfaces to dissipate localized heat from devices. Using it in conjunction with a gap filler provides even more effective thermal management. A gasket type is also available for situations requiring non-planar thermal conductive materials or non-silicone gap fillers.

Product details are available here.

This is a silicone-based thermal conductive sheet. It reduces thermal resistance by filling gaps between heat-generating devices and heat sinks, or within enclosures. There are four series with different thermal conductivity and strengths, and there is also a phase change material (PCM) that becomes gel-like as the temperature rises, which can be used as an alternative to liquid materials.

Product details are available here.

This thermal management component is designed for PCB mounting and is intended for heat dissipation of lead (TO package) devices and flat package ICs. The aluminum heatsink efficiently dissipates heat from the heat-generating device into the surrounding space, contributing to the suppression of temperature rise in natural air-cooled environments.

Furthermore, we also offer models that come pre-equipped with thermal conductive material to enhance heat transfer between the heatsink and the device, reducing assembly work and minimizing variations in heat dissipation performance.

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