Device lead bending

It is often necessary for board assembly to bend the leads of Through-Hole Technology (THT) devices when constrained by heat sink orientation, substrate, system space, etc. Packages may be formed into different configurations for board mounting, but care must be taken to avoid damage such as plating strip-off, cracked packages, or delamination. This application note includes options and guidelines for reliable lead bending.
The English version is available below.

Download materials here

Please download the Japanese version of the application note from the link below.

*Please refer to the English version for the official documentation. Please treat the Japanese version as a reference only.