When creating a board to implement an Intel® FPGA, the designer creates a schematic by referring to the documentation published by the manufacturer.

Here, we will guide you to the points that you should pay special attention to.

Intel® The Quartus® Prime software (hereinafter referred to as Quartus Prime) can also check placement based on various constraints of the device.

In addition to checking the circuit diagram with the document, please also check with Quartus Prime.

Target FPGA

・ Intel® Cyclone® 10 GX

Advance preparation

Here are some documents that can be used as reference when creating circuit diagrams.

Cyclone® 10 GX Overview (FPGA TOP)

The figure below shows the pins that need special attention when designing the Cyclone ® 10 GX board.

* The layout in the diagram has nothing to do with the actual device.

① VCC, VCC for HPS, VCC for transceiver

● Establish a measurement point near the FPGA

・Be ready to measure the power supply in case of trouble

・Refer to Power & Thermal Design & Debugging Guidelines

● If all transceivers, fPLLs, and IOPLLs on the same side are unused,

VCCT_GXB can be connected to GND (Check pin connection guidelines for details)

 

● Decoupling capacitor

・Estimate with reference to the PDN tool

・For a more detailed estimate, use a dedicated tool

<Reference>

  Power Delivery Network (PDN) Analysis Tool

  Part 9 Confirmation and Review of Capacity in FPGA Power Supply Design

● Power sequence

       

See this document (Power Sequencing Considerations for Intel Cyclone 10 GX Devices) for more details.

 

▲ Back to Cyclone 10 GX Overview

② MSEL pin

Please see below for Cyclone 10 GX MSEL pin information.

MSEL Pin Settings

Inserting pull-up/pull-down resistors(1)(2)

Cyclone 10GX

* Refer to "MSEL Pin Settings" on the link

unnecessary

(see linked documentation)

(1) A Weak Pull-Down Resistor (25kΩ) is inserted inside.

(2) If you want to switch the configuration mode, insert a 0Ω resistor to switch to VCCPGM/GND.

(3) Do not drive the MSEL pins with a microprocessor or other device.

See here for a list of MSEL pins.

 

▲ Back to Cyclone 10 GX Overview

③ Configuration pin

● DCLK

・Recommend inserting damping resistor (minimum 0Ω) 10-50Ω

・In AS mode, take care of the trace length (see the document below)

  Trace Length Guideline (from "Configuration, Design Security, and Remote System Upgrades in Intel Cyclone 10 GX Devices")

● nCONFIG, nSTATUS

・Pull up to VCCPGM via 10kΩ resistor

● CONF_DONE

・Pull up to VCCPGM via 10kΩ resistor

・Do not connect to the LED as it is.

- Due to lack of drive current, it may not light up without applying FET

● CLKUSR

・ Must be entered before configuration

- For AS mode, input 100MHz clock

- For PS, FPP mode, input 100 ~ 125MHz clock

・When using a transceiver, use CLKUSR as the calibration clock (required)

● Refer to AN822: Intel FPGA Configuration Device Migration Guideline for migration from EPCS/EPCQ to EPCQ-A

● When FPGAs are cascaded, nSTATUS and CONF_DONE are pulled up in common.

● nCE

・Connect to GND for single device configuration.

・This signal determines whether the FPGA is cascaded.

● When using nCEO, pull up to VCCPGM through a 10kΩ resistor.

 

▲ Back to Cyclone 10 GX Overview

④ JTAG pins

● Check Point

・It is recommended to insert a 0Ω damping resistor for TCK.

- To support cases where writing is not possible due to problems with the clock system

● Pin processing

・TCK: pull down via 1kΩ resistor

・TDI: Pulled up to VCCPGM via 1kΩ to 10kΩ resistor

・TMS: Pulled up to VCCPGM via 1kΩ to 10kΩ resistor

・TDO : No pull-up/pull-down

・TRST : Option used. Pull up to VCCPGM through a 1 kΩ resistor if unused.

● When cascading three or more FPGAs, insert buffers on the TCK and TMS lines.

 

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⑤ Clock input pin

● When using a single-ended clock, assign it to the p-channel

(Does not ride on global clock directly on n-channel. Limitation when using ALTCLKCTRL buffer)

● Pay attention to AC/DC coupling when inputting differentially.

● If you are using a PLL, pull down the RREF pin through a 2kΩ resistor (resistor accuracy is ±1%).

● CLK and PLL pins can be left unconnected if not used.

* Refer to "Clock and PLL Pins" in Cyclone 10 GX Device Family Pin Connection Guidelines for clock input pin names.

▲ Back to Cyclone 10 GX Overview

⑥ Other dedicated pins

pin name

comment

RREF_[T,B][L]

Pulled down through a 2kΩ±1% resistor

VREFB* Tie to VCCIO or GND in the same bank if not used as a dedicated pin
VREFP_ADC / VREFN_ADC Connect to GND if not used as a dedicated pin.

TEMPDIODEp/n

Connect to GND if not used as a dedicated pin.

 

▲ Back to Cyclone 10 GX Overview

⑦ Transceiver Pins

● When not using the transceiver

・Clocks (REFCLK_GXB*_CHp/n) are individually connected to GND or collectively pulled down via a 10kΩ resistor.

・RX (GXB*_RX_*p/n) is connected to GND

・TX (GXB*_TX_CHp/n) is floating

● AC/DC coupling

・Adjust to I/O Standard

 

▲ Back to Cyclone 10 GX Overview

⑧ DDR3 pin

Please refer to the document below.

 

External Memory Interface (EMIF) Schematic Check Items [Intel® Cyclone® 10 GX FPGA]

  

▲ Back to Cyclone 10 GX Overview

⑨ Multipurpose pin

● Connect to GND if not used as a function pin and not used as a user I/O pin.

・ CLKUSR

・ DEV_OE

・ DEV_CLR

● If nPERSTL0 is used as a reset pin for PCIe hard IP, shift down the voltage from 3.3V LVTTL to 1.8V and connect it through a level translator.

▲ Back to Cyclone 10 GX Overview

⑩ I/O pins

The RZQ pin must be processed when performing internal calibration.

Recommended to use the RZQ pin to enable the internal calibration feature.

If using 2.5/3.0-V, check if the device supports it.

▲ Back to Cyclone 10 GX Overview

Appendix: Cyclone 10 GX MSEL Pin List

MSEL Pin Settings (FPGA Configuration)

 

Device Family

Configuration Mode

VCCPGM(V)

POR Delay

MSEL[2:0]

Cyclone 10GX

AS

(x1, x4)

1.8

Fast

010

Standard

011

PS, FPP

(x8, x16, x32)

1.2/1.5/1.8

Fast

000

Standard

001

▲ Back to Cyclone 10 GX Overview

Click here for recommended articles/materials

Intel® Agilex™ FPGA & SoC External Memory Interface (EMIF) Schematic Check Items

External Memory Interface (EMIF) Design & Debug Guidelines - For V Series: Stratix® V, Arria® V, Cyclone® V

Stratix® 10 Design Guidelines

Feasibility study Design guidelines

EMIF layout guidelines

EMIF Design & Debug Guidelines

Active Serial Configuration Design & Debug Guidelines

Timing & Implementation Design & Debug Guidelines

PCI Express Design & Debug Guidelines

Power & Thermal Design & Debug Guidelines