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HyperLynx is a software integrated PCB board verification tool.

Signal integrity, power integrity, and thermal verification can be performed, and DRC (design rule check) can detect signal quality, power quality, and EMI issues before board creation. Identify the parts that connect.

We regularly hold seminars on this product. Participation applicationherefrom!

Introduction video

Feature introduction

Each feature of HyperLynx is introduced here.
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Board Signal Quality Analysis / HyperLynx SI
[with video]
Includes pre- and post-layout signal integrity, timing, crosstalk and EMC analysis tools for signals from 0 Hz to several GHz.

Board Power Quality Analysis / HyperLynx PI
[with video]
It offers various pre- and post-layout power integrity analyses, including voltage drop (IR drop) analysis, AC decoupling analysis, plane noise analysis, and model extraction.

Board Thermal Analysis / HyperLynx Thermal

After component placement in the PCB layout, board-level thermal issues can be analyzed for mid-route or post-route designs. Temperature maps, temperature gradients, and temperature limit maps help designers avoid board and component heating issues early in the design process.

Board Design Rule Checks/HyperLynx DRC
[with video]
Check PCB design rules for issues that affect EMI/EMC, signal quality, power quality, and more.

Related Information

How to download Siemens EDA tools
How to install HyperLynx
How to license Siemens EDA tools

Column: It’s not someone else’s problem! ! Heat problem basic “ki”

First IBIS-AMI simulation

Seminar/Workshop

HyperLynx SI
Rediscover the basics of signal integrity analysis and the effectiveness of pre-analysis
Gain a deeper understanding of SerDes design evaluation and analysis

HyperLynx PI
Benefits and Effects of Introducing Analysis Tools to Power Distribution Network Design
DDR4 PDN Impedance and Correlation Between Analysis and Measurement

HyperLynx DRC
FPGA board design methodology aiming for zero revisions
Shortening the time required for checking circuit board drawings and reducing the burden on engineers


Siemens EDA Seminar

Inquiry

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