*This press release contains the content announced by Winbond as it is.
HYPERRAM™ in WLCSP (Wafer Level Chip Scale Package) enables smaller and simpler form factors
June 10, 2020 Winbond Electronics Co., Ltd., a leading global supplier of semiconductor memory solutions, today announced the introduction of the WLCSP package for HYPERRAM™, which enables an unprecedented thin form factor for embedded applications. Announced.
HYPERBUS™ technology was first announced by Cypress in 2014. One of the advantages of HYPERBUS™ is its low pin count compared to other memory transmission and control interfaces. This simplifies the circuit board layout and reduces the wiring area. Several IC design firms have announced IP related to HYPERBUS™. This makes it easier to design memory controllers and more chip makers are offering products that support this interface. In line with this trend, Winbond Electronics also launched HYPERRAM™ products.
Compared to existing 3.0V HyperRAM(TM) operating at 100MHz/200Mbps and 1.8V HyperRAM(TM) operating at 166MHz/333Mbps, Winbond Electronics' HyperRAM(TM) 2.0 products have a maximum frequency of 200MHz. , 3.0V or 1.8V operating voltage to provide a maximum data transfer rate of 400Mbps.
It is also available in densities of 32Mbit, 64Mbit, 128Mbit, and 256Mbit to support various applications.
Additionally, Winbond Electronics offers a variety of package options, including:
・24-ball 8mm×6mm TFBGA: for automotive and industrial equipment applications
・49-ball 4mm×4mm WFBGA: For consumer products
・15 ball 1.48mm×2mm WLCSP (wafer level chip scale package)
・KGD (Known Good Die)
WLCSP is a technology that forms individual chips after packaging at the wafer level, instead of the conventional process of dicing individual Si chips on a wafer and then packaging them. Key benefits of WLCSP include minimal die-to-PCB inductance, improved thermal conductivity, smaller and lighter package size, and smaller footprint. This property satisfies the requirements of mobile products such as smartphones, smart watches and wearable devices. And Winbond Electronics' WLCSP HYPERRAM™ products are the best memory solutions for these applications.
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・ What you need to know about HYPERRAM™ - Alternate memory options
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