Heat dissipation from the top surface improves heat dissipation and saves board space! Power MOSFET latest Top Cool package!

Product Summary

There are two types of power MOSFETs: insertion mount type and surface mount type. Most of the medium to low voltage power MOSFETs are surface mount type (SMD). Examples of surface mount packages are SO8FL, u8FL and LFPAK. These surface mount types are chosen for their small size and power. However, although these devices have good power performance, heat dissipation is not ideal as heat conduction is primarily through the substrate.

Therefore, ONSEMI has developed a new package, the Top Cool package, which exposes the thermal pad (drain) of the MOSFET on the top side in order to improve heat dissipation and reduce the size of the application.

Main features

・Excellent heat dissipation performance by top cooling
・Minimization of conduction loss by low on-resistance RDS(on)
・Low gate charge (Qg) reduces switching loss
・Components can be mounted on the back side of the board, reducing the size of the board.
・No need for thermal via under MOSFET

Advantages of the Top Cool package

Conventional surface-mounted power MOSFETs are small packages, but as shown in the figure below, there are cases where other circuits and components cannot be mounted on the back of the board due to heat dissipation, and the overall size of the board is large. It may become.


Top cool devices on the other hand can avoid this problem. Because it has a thermal pad on the top, heat can be dissipated directly to the heatsink through the top of the device. It is shown in the figure below. This allows other low power components to be mounted on the back side of the board where the MOSFETs are located.

In addition, since heat is dissipated without passing through the printed circuit board (PCB), the amount of heat entering the PCB can be reduced, resulting in higher power density. Therefore, it leads to a reduction in board size and cost reduction.

Top Cool package lineup

package Voltage resistance [V]

On-resistance (max) mΩ

@VGS=10V

model number
TCPAK10 40

1.0

NVMJST0D9N04C

1.2

NVMJST1D2N04C

1.35

NVMJST1D3N04C

1.65

NVMJST1D6N04C

3.3

NVMJST3D3N04C
60

1.46

NVMJST1D4N06CL
80

2.8

NVMJST2D6N08H


For specifications other than withstand voltage and on-resistance, please check the ONSEMI MOSFET product selection page.

ONSEMI MOSFET product selection page [TCPAK10 package]

Application adaptation example

・e-scooter
small electric car
electric steering
oil pump etc.

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