Product Summary
IPM stands for Intelligent Power Module. Basically, it is a modularized product consisting of multiple power devices and gate driver ICs that drive them.
ONSEMI has a large number of automotive IPM products, and the main target applications are products for actuators of auxiliary equipment. Specifically, electric compressors, PTC heaters, superchargers (turbochargers), etc.
packaging technology
The main package type is the DIP type transfer mall package as shown in the lower left figure. In addition, the internal substrate structure uses DBC (Direct Bonded Copper) substrate technology, which has excellent heat dissipation.
A DBC (Direct Bonded Copper) substrate is a substrate like a ceramic plate such as AL2O3 (alumina) or ALN (aluminum nitride) coated with Cu (copper). Please refer to the lower right figure. The big advantage of this substrate is that it can be directly bonded to the substrate and the heat can be dissipated directly from the substrate, so it has excellent heat dissipation.
Advantages of using IPM
A simple comparison of the costs of discretes and IPMs reveals that discretes win out. However, considering the total cost, it is not so simple. We believe that the reduced number of parts will lead to a reduction in man-hours for management, an advantage in terms of quality, and a reduction in man-hours for gate driver design.
Of course, since power devices occupying a lot of board space are modularized, they can also contribute to board miniaturization. Furthermore, we believe that it may contribute to the reduction of design man-hours and materials related to heat dissipation measures.
IPM product page
If you are looking for IPM products, please check the product page on the ONSEMI website below.
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