Product Summary
NVIDIA® Jetson AGX Orin™ is powered by NVIDIA Ampere architecture GPUs, with next-generation deep learning and vision accelerators. Fast IO and memory bandwidth allow multiple AI application pipelines to work simultaneously. This enables the development of solutions using the largest and most complex AI models, even when solving problems such as natural language processing, 3D perception, and multi-sensor fusion.
NVIDIA Jetson AGX Orin Module
NVIDIA Jetson AGX Orin delivers unmatched performance and efficiency for robots and other autonomous machines. In addition, the NVIDIA GPU architecture is flexible enough for today's and tomorrow's AI solutions. Combining the world-class NVIDIA AI software stack with the ecosystem's diverse services and products enables faster time to market than ever before.
Jetson AGX Orin modules have AI performance up to 275 TOPS and are configurable with power consumption from 15W to 75W. This delivers more than 8X the performance of Jetson AGX Xavier™ in the same compact form factor for robotics and other autonomous machine use cases.
NVIDIA Jetson AGX Orin Developer Kit
The NVIDIA Jetson AGX Orin Developer Kit includes a power-efficient, high-performance Jetson AGX Orin module. Equipped with modules capable of up to 275 TOPS to run the NVIDIA AI software stack, this developer kit enables advanced robotics for manufacturing, logistics, retail, service, agriculture, smart cities, healthcare, and life sciences. and AI edge application development.
Product Specifications
Jetson AGX Orin Module Product Specifications
Jetson AGX Orin module has 3 types of modules: 32GB/64GB/Industrial.
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Jetson AGX Orin 32GB |
Jetson AGX Orin 64GB |
Jetson AGX Orin Industrial |
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AI performance |
200 TOPS (INT8) |
275 TOPS (INT8) |
248 TOPS (INT8) |
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GPUs |
NVIDIA Ampere architecture with 1792 NVIDIA CUDA® Cores and 56 Tensor Cores |
NVIDIA Ampere architecture with 2048 NVIDIA CUDA® Cores and 64 Tensor Cores |
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GPU max frequency |
930MHz |
1.3GHz |
1.2 GHz |
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CPU |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU2 MB L2 + 4 MB L3 |
12-core Arm® Cortex®-A78AE v8.2 64-bit CPU3 MB L2 + 6 MB L3 |
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CPU maximum frequency |
2.2 GHz |
2 GHz |
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DL Accelerator (DLA) |
NVDLA v2.0 x2 |
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DLA maximum frequency |
1.4 GHz |
1.6 GHz |
1.4 GHz |
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vision accelerator |
PVA v2.0 |
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Memory |
32GB 256-bit LPDDR5 204.8 GB/s |
64GB 256-bit LPDDR5 204.8 GB/s |
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storage |
64GB eMMC 5.1 |
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CSI camera |
Up to 6 cameras (16 via virtual channels*) 16-lane MIPI CSI-2D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps) |
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video encoding |
1x 4K60 | 3x 4K30 | 6x 1080p60 | |
2x 4K60 | 4x 4K30 | 8x 1080p60 | |
1x 4K60 | 3x 4K30 | 7x 1080p60 | |
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video decoding |
1x 8K30 | 2x 4K60 | 4x 4K30 | |
1x 8K30 | 3x 4K60 | 7x 4K30 | |
1x 8K30 | 3x 4K60 | 7x 4K30 | |
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PCIe |
Up to 2 x 8, 1 x 4, 2 x 1 PCIe Gen4 (Root Port & Endpoint) |
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USB |
USB 3.2 Gen2 x3 | USB 2.0 x4 |
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Network |
GbE x1 | 10 GbE x1 |
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display |
1x 8K60 Multimode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
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Other input/output |
UART x4, SPI x3, I2S x4, I2C x8, CAN x2, DMIC & DSPK, GPIO |
UART x4、SPI x3、I2S x4、 |
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Power Consumption |
15W ～ 40W |
15W ～ 60W |
15W ～ 75W |
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size and connector |
Thermal plate with integrated 100mm x 87mm 699-pin Molex Mirror Mezz connector |
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* Jetson AGX Orin virtual channel related camera information is not final and is subject to change.
See the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supported features.
The Industrial features of the Jetson AGX Orin Industrial module are:
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Industrial function |
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impact |
50G Operational |
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vibration |
5G Operational |
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temperature |
-40°C to 85°C (measured on TTP surface) |
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endurance temperature |
-40°C ～ 85°C |
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temperature and humidity bias |
85°C/85% RH |
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bottom filling |
SoC corner bonding & component underfill |
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ECC |
ECC DRAM ECC supported |
*Please refer to the NVIDIA Jetson AGX Orin series datasheet for the latest supported reliability tests.
https://developer.nvidia.com/embedded/downloads#?search=Data%20Sheet&tx=$product,jetson_agx_orin
Jetson AGX Orin Developer Kit Product Specifications
The Jetson AGX Orin Developer Kit comes in two versions, 32GB and 64GB of memory.
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Jetson AGX Orin 32GB Developer Kit |
Jetson AGX Orin 64GB Developer Kit |
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GPUs |
NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® Cores and 64 Tensor Cores |
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CPU |
12-core Arm Cortex-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
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DL accelerator |
NVDLA v2.0 x2 |
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vision accelerator |
PVA v2.0 |
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Memory |
32GB 256-bit LPDDR5 204.8 GB/s |
64GB 256-bit LPDDR5 204.8 GB/s |
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storage |
64GB eMMC 5.1 |
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video encoding |
2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) |
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video decoding |
1x 8K30 | 3x 4K60 | 7x 4K30 | 11x 1080p60 | 22x 1080p30 (H.265) |
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Power Consumption |
15W ～ 60W |
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* Jetson AGX Orin virtual channel related camera information is not final and is subject to change.
** See the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supported features.
Reference carrier board
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Camera |
16-lane MIPI CSI-2 connector |
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PCIe |
PCIe x16 slot support: PCIe Gen4 x8 |
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RJ45 |
Up to 10GbE |
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M.2 Key M |
PCIe Gen4 x4 |
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M.2 Key E |
PCIe Gen4 x1, USB 2.0, UART, I2S |
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USB Type-C |
USB 3.2 Gen2 x2 |
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USB Type-A |
USB 3.2 Gen2 x2, USB 3.2 Gen1 x2 |
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USB Micro-B |
USB 2.0 |
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display port |
DisplayPort 1.4a (+MST) |
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microSD slot |
UHS-1 card, up to SDR104 mode |
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Others |
40-pin header (I2C, GPIO, SPI, CAN, I2S, UART, DMIC) 12 pin automation header 10-pin audio panel header 10-pin JTAG header 4-pin fan header 2-pin RTC battery backup connector DC power jack Power button, forced recovery button, reset button |
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Size |
110mm x 110mm x 71.65mm (height including feet, carrier board, module and cooling solution) |
Case study
Jetson related articles
Articles to Read Before Buying a Developer Kit
Article for those with developer kits
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