Introduction

Silicon carbide (SiC) is part of the Wide Bandgap (WBG) semiconductor materials. In recent years, SiC products have spread rapidly in applications that require high withstand voltage and high-speed switching. In addition, SiC module products have also been released, which achieve higher switching speeds, reduced losses, and smaller final products than conventional discrete circuits. However, it tends to be avoided because the packaging is more distinctive than discrete products.
This time, I will explain how to mount ONSEMI's SiC module (PIM).

What is a press-fit pin?

Onsemi's SiC modules (PIMs) have package options that use solder pins or press-fit pins to connect to the printed circuit board (PCB).
Below is an example of a Q1 module with press-fit pins.

Press-fit pins connect pins and plated through holes (PTH) by means of press-fitting after mounting. This method avoids excessive heating and contamination and provides excellent electrical properties. The press-fit method is established as a connection method for power semiconductor modules.
Using a press-fit pin improves the adhesion between the press-fit pin and the plated through hole.

Printed circuit board and module mounting method

The distance between the top surface of the heatsink and the bottom surface of the printed circuit board (PCB) is determined by the height of the module. 12mm for ONSEMI's Q0, Q1, F1, F2 packages and 17mm for Q2 packages.
Also, PCB spacers can be used for fixing. Since the number and position of fixed points depend on the layout of the circuit, the position of capacitors and inductors, and the environment of the system, there is no general recommendation for the number and position of spacers. However, there is a recommended height for the height when using spacers.

Onsemi's Q1 package has power connectors and terminals distributed over the surface of a plastic case. Electrical connections are made by soldering these terminals to the printed circuit board (PCB) or using press-fit techniques. (Figure below)

The printed circuit board (PCB) has 4 mounting holes for spacers and 2 holes for heatsink mounting. The dimensions and locations of cutouts, plated through-hole (PTH) holes, and mounting holes are provided in the datasheet.

The figure below and the figure on the left are the recommended mounting pattern diagrams described in the data sheet of the Q1 package product. The figure on the right is the recommended mounting pattern shown in the data sheet of the Q0 package product. Note that for the Q0 package, the recommended mounting hole shape varies depending on the thickness of the PCB board.

Summary

Onsemi's SiC modules (PIM) have many packages that use press-fit pins to connect to the printed circuit board (PCB).
By using press-fit pins, it is possible to omit the solder mounting process, reduce manufacturing costs, and achieve excellent electrical characteristics.

Application example

・Solar inverter
・UPS (uninterruptible power supply)
・Charging stand for electric vehicles
・Industrial power supply

lastly

If you are looking for other SiC module products, please check the product page on the ONSEMI website below.

Onsemi Power Module Product Page

For more detailed information about the contents introduced in this article, please refer to the following application note (AND9867/D) from ONSEMI.

Mounting Instructions for PIM Modules (Q0, Q1, Q2, F1, F2)

Inquiry

If you are interested in any of the products introduced in this article, please feel free to contact us.