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Introduction
This article provides an overview of guidelines for implementing heat sinks for proper thermal management in power semiconductor devices, including SiC MOSFETs.
Precautions when installing the heat sink
In order to improve the heat dissipation of power semiconductors, a heat sink is attached to the package to increase the heat transfer area and increase the heat transfer surface. However, if the heatsink mounting method is inappropriate, the contact thermal resistance between the heatsink and package will increase, making it difficult to obtain sufficient heat dissipation performance.
Consider the following points when mounting a heat sink on the package.
Heat sink surface condition
- Flatness ≤ 16 µm (reference length 0.8 mm)
- Surface finish ≤ 0.02 mm
*Drilling is preferable for processing the through holes of the heat sink, as improper drilling may cause dents near the mounting holes, resulting in an irregular surface.
Installing the heatsink
- Thermal grease is essential for stable thermal performance in screw mounting
- Attaching a washer widens the load area and stabilizes the contact, but it slightly increases the thermal resistance.
- Insulating material with lower thermal conductivity than air is inserted between the package and heatsink to fill the air gap
- Although difficult to place the package, clip mounting is a more stable and secure method than screwing
- Table 1 shows the recommended torque for screwing through-hole packages regardless of thermal grease application.
|
package |
Representative value [kgf-cm] |
Maximum [kgf-cm] |
|
TO-220 |
4 to 5 |
7 |
|
TO-220 Full Pak |
4 to 5 |
7 |
|
TO-3P |
8 to 10 |
|
|
TO-3PF |
6 to 8 |
|
|
TO-247 |
8 to 10 |
|
|
TO-264 |
8 to 10 |
|
At the end
This article is based on ONSEMI's application note AND9859/D"Power Packages Heat Sink Mounting Guide".
For more detailed information, please check the application note from the URL below.
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