Macnica and Misora Connect begin jointly offering "Chip SIM" for industrial IoT devices – enabling improved durability and security measures through board mounting.

Macnica (Headquarters: Yokohama City, Kanagawa Prefecture, Representative Director and President: Kazumasa Hara, hereinafter referred to as Macnica) and Misora Connect, Inc. (Headquarters: Bunkyo-ku, Tokyo, Representative Director and President: Nobutatsu Morita, hereinafter referred to as Misora Connect) today, March​ ​26,​ ​2026, announced that they will begin offering industrial-grade "chip SIMs" (semiconductor type) for industrial IoT devices to further promote the utilization of LTE communication in industrial IoT.

■Background
With the expansion of the IoT market, the demand for mobile communication is increasing not only for smartphones but also for a wide variety of IoT devices. Furthermore, connected devices are being utilized in a diverse range of fields, including mobility, industrial equipment, and various outdoor meters and terminals. In these areas, the dominant method has so far been to insert a physical SIM card into the device and use cellular communication via the mobile network provided by the telecommunications carrier.
On the other hand, industrial IoT devices are required to withstand more stringent environmental conditions and operational requirements compared to general IoT devices, such as high and low temperatures, strong vibrations, and long-term outdoor use. In addition, as devices become smaller and denser, the space required for physical SIM slots becomes a design constraint. Furthermore, there are challenges such as the operational burden associated with inserting, replacing, and configuring SIMs during mass production and on-site installation, as well as the risk of theft and misuse. Against this backdrop, the use of industrial-grade "chip SIMs (semiconductor type)" is attracting attention.

■ Features of "Chip SIM"
The two companies will offer an MFF2 size (5mm x 6mm) "chip SIM" that is directly soldered onto the circuit board of an IoT device, as a means of achieving both high environmental resistance and reliability required for industrial IoT devices, while reducing the design and operational burden. This product supports a wide operating temperature range of -40°C to +105°C and has industrial-grade vibration and shock resistance, enabling stable communication even in harsh industrial environments. The structure, which is directly mounted to the circuit board, is less susceptible to the effects of temperature changes, vibrations, and moisture, significantly improving the overall durability of the product and the reliability of communication connections.
Furthermore, its tamper-resistant properties minimize security risks associated with the removal of physical SIM cards, and by eliminating the need for a physical SIM slot, it contributes to device miniaturization and high-density mounting.

■ Initiatives of both companies
By combining Macnica 's semiconductor logistics and technical expertise as a semiconductor trading company with Misora Connect's flexible communication plans as a full MVNO ^{* 1}, the two companies will provide an optimal communication and device deployment environment tailored to the uses and operations of customers, including manufacturers of industrial IoT equipment. Furthermore, by proposing appropriate communication plans according to the amount and frequency of data communication and usage, cost optimization can be achieved.
In particular, for industrial devices that require handling a wide range of temperature environments and vibrations, and for projects that demand stable operation over long periods from manufacturing to post-shipment, combining technical support from the device implementation stage based on expertise in quality control and technical support with communication services that provide integrated design, contracting, and operation of communication lines makes it possible to provide consistent support from initial specification review and evaluation to mass production startup and post-shipment communication operation. This reduces rework and operational burden at each phase, allowing the entire process from product development to service operation to proceed more safely and smoothly.

■Regarding the future
In the future, we are also considering support for remote provisioning (RSP) functionality ^{* 2} compliant with SGP.32. This will enable remote profile switching and updates, significantly simplifying post-deployment carrier changes and management processes.
Through a partnership that leverages the strengths of both companies, Macnica and Misora Connect aim to solve business challenges and foster innovation for many customers by providing the latest communication technologies, centered on industrial IoT, in an easy-to-use manner.

*1: A full MVNO is a type of MVNO that can issue and manage SIM cards in-house, and is characterized by its ability to flexibly design communication plans and network operations for IoT applications. This makes it possible to provide communication services that are based on the management of a large number of devices and long-term operation.

*2: Remote provisioning (RSP) functionality compliant with SGP.32 is an international standard specification for eSIMs developed for IoT devices. It is a technology that enables remote configuration, modification, and updating of communication profiles for chip SIMs mounted on a circuit board. This allows for more efficient changes to communication contracts and operational management, even for industrial IoT devices installed over a wide area.

[Click here for product details]
https://www.macnica.co.jp/business/connectivity/manufacturers/connect_sim_by_macnica/

[For product inquiries, please contact us here]
Macnica Connect SIM by macnica, Inc.
TEL: 045-470-9841
E-mail: connect_sim@macnica.co.jp

Misora Connect Co., Ltd.
E-mail: pr@misora-connect.com

*Company names and product names mentioned in the text are trademarks or registered trademarks of each company.
*The information published in the news release (including product price, specifications, etc.) is current as of the date of announcement. Please note that the information may be subject to change without prior notice.