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Intel: Please tell us the device mounting conditions (reflow and temperature profile).
board
Category: Specifications
tool:-
device:-
Please refer to the document below for device handling guidelines.
Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an353.pdf
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