Overview

Taichung, Taiwan - 2023-06-14 - Winbond Electronics Co., Ltd., a leading global supplier of semiconductor memory solutions, today announced the 8Mbit serial NOR flash W25Q80RV.

This is the first product in the high performance and small form factor serial NOR Flash family with high read performance to address the requirements of connected edge devices used in industrial and consumer applications.

Manufactured at Winbond's 12-inch wafer fab, the latest 8Mbit serial NOR flash W25Q80RV uses 58nm technology,

It has a significantly smaller die size compared to the previous generation manufactured on 90nm technology.

The KGD (Known Good Die) and WLCSP (Wafer Level Chip Scale Package) of this latest device are ideal for use in a variety of small IoT devices.

“IoT devices are projected to grow to 50 billion connected devices by 2023,” said Alan Niebel, president of WebFeet Research, an independent market research firm.

Winbond's 8Mbit serial NOR flash W25Q80RV is suitable for both automotive and IoT. IoT continues to grow in this new connected world,

By 2027, serial flash shipments could reach 12.9 billion worldwide."

Until now, Winbond has developed a wide range of

We have supported customer requirements for using serial NOR flash with our previous generation product, the W25QxxDV series.

In the future, we will support new use cases such as wireless connection with advanced technology KGD and small lead frame package WLCSP solution.

Winbond is also an expert in providing KGD solutions to customers for over 10 years.

KGD is fully baked and tested to be as reliable as packaged products.

Ideal for stacking with MCUs and SoCs targeting miniaturization and high-speed flash access. The latest 8Mbit serial NOR flash W25Q80RV offers faster read speeds to improve system performance,

It has a faster program speed suitable for firmware OTA (Over-the-Air) updates, a smaller form factor, and offers great value for various embedded systems.

The 8Mbit Serial NOR Flash W25Q80RV supports standard Serial Peripheral Interface (SPI), Dual/Quad SPI.

It is ideal for dual/quad SPI direct code execution (XIP: Execute In Place) and code shadowing to RAM. It operates from a single 2.7V to 3.6V power supply and consumes a minimum of 1µA current in power-down mode.

The memory cells are organized in small 4KB sectors, allowing for greater flexibility and storage efficiency in applications requiring storage of code, data, parameters, etc.

The SPI clock frequency supports up to 133MHz, achieving a clock rate equivalent to 266MHz (133MHz x 2) for dual I/O and 532MHz (133MHz x 4) for quad I/O.

The Read Command Bypass mode enables fast memory access and provides true XIP operation.

“the Company are proud to offer KGD and WLCSP serial flash memory solutions for applications requiring small non-volatile storage in MCUs and SoCs.

the Company will continue to work closely with our customers to provide added value for the next generation of embedded systems," said Jackson Huang, Vice President of Flash Product Marketing at Winbond.

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