This article contains a press release from Winbond Electronics.

Winbond Sets Global Sustainability Standards with Sustainability Commitment and Products

Having won numerous awards and recognition for its industry-leading sustainability performance in 2021-2022, Winbond

Aiming to further improve our leadership in the ESG field in 2023

Overview

Taichung, Taiwan - April 26, 2023 - Winbond Electronics Co., Ltd., a leading global supplier of semiconductor memory solutions,

Today, we unveiled our sustainability performance and announced aggressive goals and product development plans to strengthen our leadership.

 
In addition to corporate Environmental Social and Governance (ESG) goals and initiatives, Winbond
Flash memory products supporting Low Temperature Soldering (LTS) process, space-saving technology used in 100BGA LPDDR4/4X,

We demonstrate our commitment to sustainability through product development, including advances in ultra-low power consumption.

Winbond semiconductor memory contributes to a sustainable future

 

Below are some examples of sustainability that Winbond has achieved in 2022.

See here for all achievements.

 

● Reduced greenhouse gas emissions by 229,245 tons-CO2e (equivalent to about 380 Ariake Tennis Park)

● Reuse 7,212 tons of waste with a recycling rate of 93%

● Reusing 10.59 million m3 of water with a recycling rate of 83% at the Taichung Factory

"As a company that leads the semiconductor memory product industry, the Company
We are uniquely positioned to contribute to carbon neutrality and curb global warming,” said Winbond.
“Sustainability is a global issue and we are proud to contribute to driving a greener and more sustainable future.”

purpose

Starting this year, Winbond intends to take further steps in the following areas to achieve its tangible targets by 2030 and 2050.

 

● Achieve 90% green energy consumption at Taichung Factory by 2030 compared to 2021

● Achieve a 60% reduction in carbon emissions from the Taichung Plant by 2030 compared to 2021

● Achieve net zero by 2050

● Continue to evaluate and promote new water-saving measures

● Collaborate with the government's renewable energy policy to plan and assess the feasibility of introducing renewable energy.

● TCFD (Task Force on Climate-related Financial Disclosures)

Introduced a management framework. Continue to implement new energy-saving measures.

● Actively cooperate with partners who promote sustainable development agendas;

Going forward, we will improve and strengthen sustainable supplier management, including sustainability risk assessments and document-based and on-site audits.

Product design with sustainability in mind

One of Winbond's corporate goals is to design products that support our commitment to sustainability. Here are some examples.

 

● LTS process

Announced support for the Low Temperature Soldering (LTS) process, which lowers Surface Mount Technology (SMT) temperatures from 220-260°C for lead-free processes to a maximum of 190°C.
With this new process, Winbond contributes to the simplification, shortening and cost reduction of the SMT process as well as the significant reduction of CO2 emissions in the SMT production line.

● Space-saving technology

Winbond announced that the new package 100BGA of LPDDR4/4X, which realizes energy saving and carbon reduction, has achieved the JEDEC JED209-4 standard.
LPDDR4/4X is now available in a space-saving 100BGA package of just 7.5x10mm2.
Ideal for compact IoT applications that require small size and high throughput, allowing designers to reduce PCB size.

● Ultra low power consumption

Winbond has announced several flash memory product designs with ultra-low power consumption.
One example is a 1.2V NOR flash that consumes 1/3 less power than traditional 1.8V NOR flash.

●  HYPERRAM(TM)

Ultra-low power consumption, simplified design, and low pin count enable space saving and small form factor.

● Secure Flash

Winbond innovates security on the memory side and contributes to customer product protection.
And announced that TrustME(R) W77Q Secure Flash has obtained SESIP Level 2 certification for resistance to physical attackers.
Each TrustME product family (W77Q, W75F, W76S) proves to be a secure and reliable solution.

List of Awards and Commendations in 2022

Winbond has received numerous awards and recognition for its sustainability achievements over the past year. Some of them are introduced below.

 

<Certification, quality, intellectual property patents, green products>

● Obtained "ISO 50001 Energy Management System Certification"

● Acquired ISO/SAE 21434 “Road vehicle - Cybersecurity engineering” International Standard Automotive Cyber Security Management System (CSMS) certification from TUV NORD for the first time in the world as a memory manufacturer.

● Passed 2022 RBA Code of Conduct compliant factory inspection

● Won the Gold Tower Award and the Silver Tower Award twice each at the Taiwan Continuous Improvement Competition (TCIA), achieving the best results ever.

● Approximately 380 patents will be acquired by 2022, with a cumulative total of over 4,500 patents worldwide

● TrustME(R) W77Q Secure Flash Memory won the 2022 OFweek IoT Industry Innovation Technology Product Award. Also SESIP Level 2 certified

● HYPERRAM(TM) 3.0 won the 7th China IoT Innovation Awards 2022

 

<Received the ESG Comprehensive Evaluation Award>

● Received awards in the following three categories at the 2022 Taiwan Corporate Sustainability Awards (TCSA).

1. Corporate Sustainability Report Platinum Award

2. Corporate Sustainability Comprehensive Performance Award - Taiwan Top 100 Sustainability Model Company Award

3. Sustainable Single Performance - Talent Development Leader Award 2022 BSI Sustainability Excellence Award

● Ranked 6-20% of listed companies in the 8th Corporate Governance Evaluation

● Selected as a constituent company of “Taiwan Stock Exchange Corporate Governance 100 Index” and “Taiwan High Salary 100 Index”

● Selected as a constituent company of “FTSE4Good FTSE Emerging Market Index” and “FTSE4Good Taiwan Sustainability Index”

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