Overview

This article contains a press release from Winbond Electronics.

Winbond Electronics Corporation today announced that it has joined the UCIe(TM) (Universal Chiplet Interconnect Express(TM)) consortium.

This open standard defines a communication scheme for interconnecting multiple chiplets within a single package, enabling an open chiplet ecosystem and facilitating the development of advanced 2.5D/3D devices.

Winbond Joins UCIe Consortium

Winbond, a leading company in high-performance memory ICs, has an established reputation as a supplier of KGD (known good die), which is essential for improving the final yield of 2.5D/3D packaging.

2.5D/3D multi-chip devices are needed to achieve breakthroughs in performance, power efficiency, and miniaturization due to the rapid development of technologies such as 5G, automotive, and artificial intelligence (AI).

Winbond joins UCIe consortium to help simplify System On Chip (SoC) design and standardize interconnects to facilitate 2.5D/3D back-end-of-line (BEOL) implementation .

The UCIe 1.0 specification provides a fully standardized die-to-die interconnect that enables high-bandwidth interfaces for low-latency, low-power, and high-performance SoC and memory interconnects.

Ultimately, standardization will accelerate the introduction of high-performance products that offer higher value to device manufacturers and end users, and drive market growth for advanced multi-chip engines.

Winbond's 3D CUBE as a Service (3DCaaS) platform provides customers with a one-stop shopping service.

This includes 3D TSV DRAM (aka CUBE) KGD memory die, 2.5D/3D BEOL with optimized CoW/WoW for multi-chip devices, in addition to consulting services.

This means that customers can get more complete and comprehensive support from CUBE, as well as additional value such as silicon caps and interposers.

Winbond is dedicated to providing the best product solutions, and joining the UCIe consortium will enable us to provide customers with standardized 3D DRAM and 2.5D/3D BEOL services.

■ Comment from Hsiang-Yun Fan, DRAM Vice President of Winbond

“The UCIe specification allows 2.5D/3D chip technology to unlock its full potential in AI applications from cloud to edge.

This technology will not only continue to improve performance, but will play a major role in ensuring the accessibility of cutting-edge digital services.”

■ Comment from Dr. Debendra Das Sharma, Chairman of the UCIe Consortium

“We are delighted to welcome Winbond to the UCIe Consortium.

As a global supplier of high-performance memory solutions with expertise in 3D DRAM, we look forward to contributing to the further development of the UCIe chiplet ecosystem."