Winbond Electronics Co., Ltd., a world-leading supplier of semiconductor memory solutions, today announced that its flash memory products have a surface mount technology (SMT) temperature range from 220-260°C for lead-free processes up to 190°C. Announced support for Low Temperature Soldering (LTS) process down to ℃.

With this new process, Winbond contributes to the simplification, shortening and cost reduction of the SMT process as well as the significant reduction of CO2 emissions in the SMT production line.

● Emphasizes the company's stance as a company that tackles global environmental issues and the realization of sustainability

● From November 2022, SON and BGA package flash memory products support LTS (Low Temperature Soldering).

● Migration to LTS contributes to simplification, shortening, and production cost reduction of SMT process

According to the International Electronics Manufacturers Association (iNEMI), the market share of LTS applications is expected to increase from less than 1% to more than 20% by 2027, showing the electronics industry's commitment to environmental issues and sustainable development. is highlighted. Winbond is at the forefront of the global trend as a flash memory provider that offers this process, and its LTS-enabled products comply with JEDEC standards for reliability, including drop test, vibration test, and temperature cycling test. We have already demonstrated that it passes validation.

Winbond said:
“Winbond will leverage its position as a leader in flash memory products to contribute to carbon neutrality and curb global warming. We are also calling on global leaders to take action for a greener and more sustainable future.”

Key benefits of migrating to the LTS process include:

● Reduction of carbon dioxide emissions -
According to Intel's "Introduction to Low Temperature Soldering (LTS) 2017" (Introduction to Low Temperature Soldering 2017) P18-19, each SMT production can be CO2 emissions from the line can be reduced by 57 tons per year.

● Simplified and accelerated SMT process for PCB by using plug-in components -
The plug-in components can withstand the temperatures of the low-temperature soldering process, allowing the SMT line to assemble all components on the PCB at once. This greatly simplifies and shortens the SMT process.

● Cost reduction -
As the soldering temperature drops, lower cost and lower temperature materials can be selected for chips and PCBs. According to Intel's "LTS 2017" P15-16, moving to LTS can reduce the total annual cost of SMT production by about 40%.

Winbond will also be present at EdgeTech+ 2022 (booth number B-J17) at Pacifico Yokohama from November 16th to 18th, and at Electronica Munich (Hall B4-320) from November 15th to 18th. We will exhibit at Electronica Shenzhen (Hall 2F-80) under the theme of "Next Future: the memory of everything".