Winbond Electronics Co., Ltd., a leading global supplier of semiconductor memory solutions, and Infineon Technology, a global leader in semiconductor solutions, microelectronics and IoT, have expanded the scope of their collaboration on HYPERRAM™ products, further Announced the new high-bandwidth HYPERRAM™ 3.0.

This HYPERRAM product line has a smaller form factor than traditional pseudo-SRAM and is suitable for IoT applications that require external RAM and are power and space constrained.

With a maximum frequency of 200MHz and an operating voltage of 1.8V, HYPERRAM 3.0 is the same as HyperRAM 2.0 and OCTAL xSPI RAM, but doubles the data transfer speed to 800MBps. This new generation of HYPERRAM works with an extended 22-pin HyperBus™ IO interface.

Ramesh Chettuvetty, Senior Director Marketing & Applications, Infineon Technologies, said:

“As a leading provider of memory solutions, Infineon offers a family of solutions that deliver high performance in a smaller form factor for next-generation IoT applications. 256 Mbit HYPERRAM™ 3.0 devices are sampling now.Infineon Technology, in collaboration with Winbond, is pleased to announce this new memory We are excited to expand our adoption of the technology.”

Winbond also said: “HYPERRAM™ has three features: low pin count, low power consumption, and easy control, which can greatly improve the performance of IoT end devices.

Compared to Low Power DRAM, SDRAM and CRAM/PSRAM, it greatly simplifies PCB layout design and extends battery life in mobile devices, and its low pin count allows it to work with smaller form factor processors."

Emerging IoT devices require higher memory performance to perform voice control and tinyML inference as well as simplified machine-to-machine communication.

The HYPERRAM family is ideal for low-power IoT applications such as instrument clusters in wearables and automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays and communication modules.

HYPERRAM 3.0 is a new generation that can operate with the same command/address signals and a similar data bus format as HYPERRAM 2.0, with increased bandwidth and the ability to operate at the same standby power with few pin changes.

The first member of the HYPERRAM 3.0 family is a 256 Mbit product in KGD and WLCSP packages, which can be implemented at component level, module level or PCB level, depending on the type of end product.