Winbond Electronics' 256Mbit HyperRAM 2.0e KGD (Known Good Die) provides the Efinix Ti60 F100 with the performance, low power consumption and small size required for embedded AI applications at the edge.

Significant footprint reduction and design simplicity with Winbond's HyperRAM 2.0e KGD requiring only 22 signal pins compared to the 31-38 typical signal pins required for conventional DRAM possible

Featuring ultra-low power consumption, Winbond's HyperRAM delivers performance equal to or better than SDRAM in active mode, with ultra-low power consumption of 140uW in standby mode and only 70uW in hybrid sleep mode.

Taichung, Taiwan - October 20, 2021 Winbond Electronics, a leading global supplier of semiconductor memory solutions, today announced that Efinix, an innovator in programmable product platforms and technologies, has launched AIoT, thermal and industrial cameras. announced that Winbond's HyperRAM(TM) has been adopted for a new generation of camera and sensor systems such as robots, smart devices and more. Winbond's 256Mbit, x16 HyperRAM 2.0e KGD offers ultra-low power consumption in a high-performance small form-factor design, providing an easy-to-implement and complete memory system for the Efinix Titanium Ti60 F100, allowing the product to It enables fast time to market and excellent cost efficiency.

About Ti60 F100

The Efinix Ti60 F100, which is shipping now, has 60K worth of logic and high-speed I/O that supports various protocols, as well as built-in SPI flash and HyperRAM. It's in the package. The combination of FPGA logic and data storage makes the Ti60 F100 a great solution for various camera and sensor systems. SPI Flash eliminates the need for a configuration device and allows HyperRAM to store user data.

Customers can use HyperRAM to store video frame buffers, AI weights and biases, Time of Flight (ToF) sensor parameters, RISC-V SoC firmware, and more. For more information on Efinix's platform, please visit this link.

Comment from Mark Oliver, Vice President of Marketing, Efinix

The Ti60 F100 targets edge and IoT applications where small physical size and low power consumption are key. Winbond's ultra-low power consumption and small form factor combined with the low power consumption of the Titanium family can meet these requirements. Winbond HyperRAM's low pin count made it easy to integrate into a small 5.5mm2 multi-die system-in-package.

About HyperRAM

Winbond's HyperRAM is ideal for embedded AI and classification applications that require electronics to be as small as possible while providing sufficient storage and data bandwidth to support compute-intensive workloads such as image recognition. Ideal for image processing for HyperRAM operates at a maximum frequency of 200MHz with an operating voltage of 3.3V or 1.8V, providing a maximum data transfer rate of 400Mbytes/second. It also provides ultra-low power consumption in operating mode and hybrid sleep mode.

For example, Winbond's 64Mbit HyperRAM has a standby power of 70uW at 1.8V at room temperature, and most importantly, the power consumption of HyperRAM in hybrid sleep mode is only 35uW at 1.8V. In addition, the 64Mbit HyperRAM (x8) has only 13 signal pins, greatly simplifying PCB layout design. When designing the final product, designers can increase the MPU's pinout for other purposes or use a lower pin-count MPU for greater cost effectiveness.

The figure below shows the configuration of Winbond's 256Mbit, x16 HyperRAM 2.0e KGD on the Efinix Ti60 platform.

Low power consumption memory, small number of pins and space saving enable easy expansion of memory area

Winbond HyperRAM has a capacity of 256Mbits, a clock rate of up to 200MHz, a HyperBus interface for high-speed communication, and supports double data rates up to 400Mbps. With memory integrated into the package, designers can store video frame data and sensor data and process them in FPGA logic without having to reserve board space for a separate memory device. increase.

winbond comment

Device makers are adding sensors and connectivity to their products for nearly every next-generation application, driving the need for more processing power at the edge while keeping devices small. HyperRAM is optimized for these applications with its ultra-low power consumption with hybrid sleep mode, simplified design with fewer active pins, and small die size. Brand customers and system manufacturers can design the Ti60 (256Mbit, x16 HyperRAM KGD for System in Package) with a smaller PCB size and easily embed it into small application devices such as wearable cameras.

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