3.1 billion units shipped in 2019, maintaining No.1 sales of serial NOR flash memory since 2012

According to recent market data from WebFeet Research, Winbond Electronics held the global No. 1 position in 2019 with a 22.8% share of the NOR flash memory market based on revenue. As evidence of this result, in 2019 we shipped more than 3 billion units, equivalent to 27.3% of the world's total NOR flash memory shipments, solidifying our position as the top leader. In addition, Winbond has been the top supplier of serial NOR Flash since 2012, with a 27.1% share of the $2.09 billion market. Winbond Electronics has its own 12-inch wafer factory in Taichung, Taiwan, to meet the growing global customer demand for flash memory. We are building a factory. This will enable the existing Taichung factory to expand production and volume of flash memory to meet the demand for new applications such as AI, automotive, storage, networking, and 5G.

Continued growth of serial flash in particular in the NOR flash market

Alan Niebel, Founder and CEO of WebFeet Research, said: “Global serial NOR flash shipments will continue to grow from $2 billion in 2019 to over $2.89 billion in 2024. Now Winbond Electronics is well positioned to take advantage of this market growth with its rich product and packaging ideas, broad product portfolio and innovation in manufacturing capabilities."

ウィンボンド・エレクトロニクスの社長であるPei-Ming Chen氏は次のように述べています。「当社のシリアルフラッシュメモリが多くのお客様に支持され、NORフラッシュメモリの世界的トップサプライヤとなったことをとても嬉しく思います。2020年以降さらなる成長が見込まれるため、幅広い高容量アプリケーションに対応した製品の生産を拡大していきます」

Advanced flash technology for high volume applications

Since the launch of the first serial flash product in 2006, Winbond Electronics has shipped more than 20 billion serial flash memories. During this time, the company has continued to evolve its process and packaging technology. Winbond Electronics launched its first 58nm process products in 2011 and now offers a wide range of high density 58nm serial flash memory products ranging from 16Mbit to 1Gbit density and supporting 3V and 1.8V operating power supplies. It is provided in a simple package and KGD (Known Good Die). It also plans to move to a 4xnm process by 2021. 58nm technology is more cost-effective than 90nm technology, and can provide more feature-rich, high-performance solutions. 90nm technology is mainly used for 512Kbit to 16Mbit low-density serial flash products and automotive applications, which is a major customer. Winbond Electronics' flash business is expected to grow further in 2020 and beyond as more applications require higher-capacity serial flash memory. Key applications driving this demand include smartphones, set-top Box, digital TVs, electronic games, wearables and hearables, cable and DSL modems, wireless LAN, networking, automotive, servers, next generation gaming, 5G, etc. You can Winbond Electronics now offers higher density 512Mbit and 1Gbit 58nm NOR Flash memory at 3V and 1.8V to meet the industry's need for high density memory. Please contact Winbond Electronics for more information on products and packages.

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