Winbond Electronics, a global supplier of semiconductor memory solutions, has announced a new product "1 Gbit LPDDR3".

The rapid spread of IoT (Internet of Things) along with AI (Artificial Intelligence) technology is expected to increase the demand for new applications powered by AI engines in the coming years. If AIoT devices become familiar to people, their daily lives will become richer and more fulfilling. Winbond Electronics' 1Gbit LPDDR3 will strongly support the market entry of AI devices. New solutions, including surveillance cameras, smart home applications, and 8K TVs, are driving demand for semiconductors. Therefore, many IC design and chipset suppliers are developing new-generation SoCs with higher performance to reduce time-to-market in a cost-effective manner. Additionally, from an overall system design perspective, DRAM used in SoCs or microcontrollers will require new options that leverage existing specialty DRAM products while offering greater benefits.

Established the only position in the 1Gbit LPDDR3 market with high bandwidth and cost performance

Winbond Electronics has a clear understanding of this market trend and is committed to providing high-performance, high-speed low-to-medium density memory to help customers achieve successful business models and drive market growth. The mobile DRAM series featuring low operating power currently includes LPDDR3 and LPDDR4/4x, and LPDDR4x features even lower operating power VDD2 (0.6V) and FSP (frequency setting) function. A 32-bit wide 1Gbit LPDDR3 is an alternative solution for high bandwidth requirements (8.52GByte/s, 0.3W). Winbond Electronics will further expand its product portfolio to meet the needs of various AIoT and high-resolution display applications.

Winbond Electronics' LPDDR3 and LPDDR4 series provide optimal solutions for different customers. Low-capacity memory of about 1 Gbit may be suitable even for applications that require high data transfer speeds. For example, using low capacity LPDDR3 with 32-bit wide or 64-bit wide data bandwidth for T-Con.

These new T-Con. chipsets will support key features such as super-resolution, MEMC (Motion Estimation Motion Compensation), and AI Image Quality (AIPQ), with 1 Gbit or so LPDDR3 memory with high data transfer rate characteristics. is required. This chipset designer will prefer the high speed LPDDR3.

A typical 8K TV T-Con. SoC chipset design example uses two or four 16-bit wide 1Gbit DDR3. Winbond Electronics proposes a cost-effective solution that replaces one or two 32-bit wide 1Gbit LPDDR3s. This approach provides data throughput of 8.52 Gbytes/s or 17.04 Gbytes/s, which is more than enough to meet equipment design requirements. Cost and power savings are the main benefits.

On the other hand, considering the characteristics of AI image quality, it is possible to use two Winbond LPDDR3 memories as a replacement for LPDDR4. When migrating from LPDDR2, LPDDR3 retains 90% circuit design similarity to the previous generation LPDDR2, making the design much easier than going directly from LPDDR2 to LPDDR4. This similarity between LPDDR2 and LPDDR3 provides the benefits of reduced cost and reduced product development time.

LPDDR3は製品開発時間短縮に貢献

In recent years, embedded system developers have faced the challenge of upgrading LPDDR2 memory for new embedded SoC chips. Validation and testing of new designs can take considerable time, and when migrating from LPDDR2 to LPDDR4, designers need more time to ensure signal integrity while meeting the tight timing margins of the LPDDR4 specification on a limited schedule. You need to allocate more resources. It also entails various risks. However, as mentioned above, LPDDR3 has the great advantage of being 90% similar to the design of LPDDR2.

Over the past nine months, Winbond Electronics' 1Gbit LPDDR3 has been adopted in more than 15 new SoC chipset designs by leading IC design companies in Asia, including Taiwan, Japan, South Korea and China. End products include AIoT, AI inference chips, 8K TV T-Con., AI-enabled video processors, smart speakers, smart video door phones, mobile POS systems, etc. Market demand is expected to increase from this year to next year.

The trend of using AI technology to power smart applications ushers in a new era of semiconductor devices and embedded systems, which brings many new opportunities but also various challenges. Winbond Electronics is a leading integrated memory device manufacturer, offering a comprehensive and competitive niche DRAM product range. These unique product groups can also provide high-quality, high-performance SiP solutions by KGD (Known-Good-Die) and support various applications.

Winbond Electronics, which handles mobile DRAM, specialty DRAM, and code storage flash memory, is focusing on enhancing the competitiveness of its unique product brand by leveraging its advanced design skills and production technology. We strive to design products that meet the needs of the niche memory market. In addition, our own factory for 12-inch wafers supports the latest technology and provides customers with highly cost-competitive services and long-term support.

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