TurboX™ T62 SOM with Qualcomm® Snapdragon™ X55

TurboX™ T55 SOM with Qualcomm®Snapdragon™X55(SDX55)

TurboX™ T55 SOM is a 3GPP Release 15 compliant communication module equipped with Qualcomm® Snapdragon™ X55 5G modem RF system (SDX55 chipset). It supports Sub-6 GHz and mmWave frequency bands, supports SA/NSA modes, and is backward compatible with 4G/3G networks. The built-in GNSS receiver supports GPS/GLONASS/BeiDou/Galileo/QZSS using both L1 and L5 bands, enabling more accurate and reliable positioning performance. Two types of packages are available: LGA and M.2.

TurboX™ T55 SOM

TurboX™ T55G SOM - LGA

Specifications

Description

SDX55 Chipset

CPU

Arm Cortex-A7 up to 1.5GHz

DSPs

Qualcomm® Hexagon™ DSP processor up to 1.5GHz

Power management

PMX55

RF Transceivers

SDR865

Memory

DRAM/NAND

4Gb DDR4 + 4Gb NAND

AirInterface

5GNR

sub-6 GHz: n28, n41, n77, n78, n79

LTE (Cat20 UL/DL)

B1/B3/B5/B7/B8/B18/B19/B20/B26/B28/B32/B34/B38/B39/B40/B41/B42

WCDMA

B1/B3/B5/B8/B19

GNSS

GPS/Beidou/GLONASS/Galileo/QZSS, L1/L5 bands supported

Data rate

Peak Download Speed

5G NR: 3Gbps DL 4×4 MIMO

Peak Upload Speed

5G NR: 900Mbps

Connectivityand

PeripheralInterface

BLSP

4x BLSP supports UART, SPI, and I2C

Antenna Connector

8x sub-6GHz, 1x GNSS

UIM

2 x USIM DSSS&DSDS

PCI express

2x Gen 3

I2S

2xI2S/PCM

USB

1x USB 3.1

Form factor

LGA

LGA Package: 42.5*42*2.6mm

Weight

 

11.05±0.2g

Power

Voltage Range

3.0~4.35V, Typ.3.8v

Temperature Range

Operations

-30°C to +75°C

Storage

-40°C to +85°C

TurboX™ T55M SOM - M.2

Specifications

Description

SDX55 Chipset

CPU

Arm Cortex-A7 up to 1.5GHz

DSPs

Qualcomm® Hexagon™ DSP processor up to 1.5GHz

Power management

PMX55

RF Transceivers

SDR865 (+ SMR526 for mmWave)

(*Please contact us if you are interested in mmWave compatible products. T55M: Sub6 only, T55MM Sub6 + mmWave)

Memory

DRAM/NAND

4Gb DDR4 + 4Gb NAND

AirInterface

5GNR

sub-6GHz: n28,n41, n77,n78,n79

mmWave: n257, n258

LTE (Cat20 UL/DL)

B1/B3/B5/B7/B8/B18/B19/B20/B26/B28/B32/B34/B38/B39/B40/B41/B42

WCDMA

B1/B3/B5/B8/B19

GNSS

GPS/Beidou/GLONASS/Galileo/QZSS, L1/L5 bands supported

Data rate

Peak Download Speed

Sub-6G: 3Gbps DL 4×4 MIMO; mmWave: 6.2Gbps(DL 800M 8CC 2x2 64QAM)

Peak Upload Speed

Sub-6G: : 450Mbps(UL no MIMO); mmWave: 1.35Gbps(UL 200M 2CC)

Connectivityand

PeripheralInterface

PCIe

1x Gen3 1Lane

I2S/PCM

1

USIM

1

Antenna Connector

4 x sub-6GHz, (8 x mmWave), 1 x GNSS

Form factor

M.2 Key B

52.0mm × 30.0mm × 2.3mm

Weight

9.2±0.5g

Power

Voltage Range

3.0~4.35V, Typ.3.8v

Temperature Range

Operations

-30°C to +75°C

Storage

-40°C to +85°C

Regarding the T55M, we have completed the interoperability test (IOT) at NTT Docomo / KDDI (au).

TurboX™ T55 Development Kit

T55 G/M MiFi Dev Kit

Specifications

Description

Platform

T55 5G SOM + QCA6391, (+T55M SOM)

Memory

4Gb DDR4

Storage

4Gb NAND

Wireless connectivity

QCA6391: 802.11ax WiFi + BLE 5.1

Wired Connectivity

1 x GbE; 1 x 10GbE;

Audio

WCD9340 Codec: DMIC x1; AMIC x1; Headset x1

USB

1x Micro USB(For Debug); 1x USB 3.0 Type C;

OtherInterfaces

1 x SPI Display; 1 x Jtag; 1 x Fan; 5 x LEDs; 1 x TF Card ;1 x GPS Ant Connector;

*T55M SOM can be evaluated only for USB IF. A separate board is required for PCIe IF evaluation.
* Also, when evaluating the T55M SOM, functions such as QCA6391 on MiFi DevKit cannot be used.

Inquiry / Quotation

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