TurboX™ D845 SOM Overview
Thundercomm TurboX™ D845 SOM is based on Qualcomm® Snapdragon™ 845 processor,
It is a small computing module with a size of 60mm x 37mm.
Equipped with a very powerful CPU/GPU/DSP, it can also be equipped with edge AI functions such as image recognition and object detection.
In addition, the software is compatible with both Android / Linux OS, and is expected to be used in various embedded devices.
Product Specifications
|
Category |
Items |
Description |
|
Platform |
Chipset |
Qualcomm® Snapdragon™ 845 processor |
|
CPU |
64-bit applications processor (Kryo 385) with 2MB L3 cache; |
|
|
GPUs |
Qualcomm® Adreno™630 graphics processing unit(GPU) 4K 60fps or 2x2k 90fps |
|
|
DSPs |
Compute DSP with Qualcomm® Hexaron™ Vector |
|
|
OS |
Android/Linux |
|
|
Memory and Storage |
LPDDR4x 4GB + UFS 64GB |
|
|
Multimedia |
Display |
2x MIPI-DSI 4-lane, Up to 3840*2400@60fps |
|
camera |
Qualcomm® Spectra™ 280 ISP: Support 3 x 4-lane MIPI_CSI + 1 x 2-lane MIPI_CSI, Dual 14-bit ISP + one Lite ISP, up to 32MP |
|
|
Decode |
4K60 decode for H.264 High Profile, H.265 Main 10 PROFILE and VP9 Profile 2 |
|
|
Encode |
4K60 encode for H.264 High Profile, |
|
|
Connectivity |
WIFI/BT |
802.11a/b/g/a/n/ac 2x2 MIMO & BT 5.0 with BLE |
|
Interface |
Interface |
USB3.1 x 2; PCIe2.1 x 1; PCIe3.0 x 1; |
|
Dimension |
Size |
60mm x 37mm x 6.4mm |
|
System |
Power |
+3.8V/3A Input |
|
Operating Temp |
-20°C ~ 70°C |
|
|
Storage Temp |
-40°C ~ 70°C |
|
|
relative humidity |
5 to 95% non-condensing |
TurboX™ D845 Development Kit
In addition to the standard functions of TurboX™ D845 SOM, this evaluation board is equipped with a bridge chip to support various I/Os.
For example, 2 x USB2.0, 2 x Ethernet, 1 x Mini PCIe Socket, 1 x CAN, 2 x HDMI Output.
Please contact us for details.
Inquiry / Quotation
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