Introducing a compact, high heat dissipation TOLL package for 650V GaN HEMT!

　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　
ROHM Co., Ltd. has begun mass production of the GNP2070TD-Z, a 650V GaN HEMT in a TOLL (TO-LeadLess) package.
The TOLL package is small and has high heat dissipation, while also offering excellent current capacity and switching characteristics, making it increasingly popular in applications that require high power, such as industrial equipment and automotive equipment.

The new product is equipped with a second-generation GaN on Si chip in this TOLL package, and the device performance index (R _DS(ON) × Q _oss), which shows the correlation between on-resistance and output capacitance, is as follows:
​^{This achieves industry-leading values.*} This contributes to further miniaturization and energy saving of power supply systems that require high voltage resistance and high speed switching.

* According to ROHM research as of January 30, 2025

<Application Examples>
It can be installed in a wide range of power supply systems with output power ranging from 500W to 1kW.

 

For details, please see here (ROHM website)

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