Product Summary

Thanks to their advanced technology and high reliability, Renesas MOSFETs have an overwhelming share of the market in both the industrial and automotive fields and continue to support powertrains around the world.

Features

The main features of Renesas MOSFETs are as follows:

Cu Clip Bonding Technology

Achieve high power density and improve current capability

Ultra-low Rds(on) and low parasitic inductance, and excellent package reliability

Side-wettable flank technology

Solder fillet provides superior solder joint performance and reliability

The soldering condition can be confirmed by simple visual inspection (with the human eye).

Cost reduction by optimizing the AVI process in the PBA (Printed Circuit Board Assembly) process

Package shape with excellent heat dissipation performance

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