Qualcomm Dragonwing™ IQ9 Series

The Qualcomm Dragonwing™ IQ9 Series Platform is a high-performance, highly reliable industrial SoC platform designed for industrial applications and advanced edge AI applications such as robotics. Built for operation in harsh environments, it supports a wide temperature range from -40°C to +115°C and incorporates industrial-grade design elements such as ECC memory and dedicated safety subsystems for enhanced reliability.

This series employs a heterogeneous architecture combining a Kryo™ Gen 6 CPU, Adreno™ 663 GPU, and Hexagon™ Tensor Processor, providing the flexibility to simultaneously execute multiple AI, video, display, and camera processes.
Furthermore, by incorporating an MCU-like real-time subsystem, it can also meet the needs of industrial applications requiring safety and real-time control.

Furthermore, with support for multiple operating systems including Linux Yocto and Ubuntu, abundant wired I/O and expansion interfaces, and support for a long-term supply program, it is positioned as a platform that allows developers to design and deploy products with peace of mind over the long term.

Product Specifications

Products	IQ-9075	IQ-9075	IQ-9100
SKU	QCS9075-AC	QCS9075-AA	QCS9100-AA
CPU	Octa-Core Kryo Gen 6
CPU Clock	2.1 GHz	2.36 GHz
AI Performance	50 dense TOPS	100 dense TOPS
GPUs	Adreno 663 GPU
GPU Clock	530 MHz	800MHz
Memory	6x16 LPDDR5 @ 3200 MHz
Addressable Memory	Up to 36 GB with inline ECC
Audio DSP (LPASS)	1980 MPPS, 7x TDM/I2S 3x High-Speed I2S for Radio FE
Display Support	Max 48 Mpix and 12 displays with no superframe 5x 4K60, 3x 4K60 + 8x 1080p60, 2x DSI + 2x DP/eDP MST2 + 2x DP/eDP MST4
Video Decode	1x 8K60, 2x 8K30, 4x 4K60, 8x 4K30, 16x 1080p60, 32x 1080p30 Formats: AV1, H.264, H.265, VP9, MPEG2
Video Encode	2x 4K60, 4x 4K30, 8x 1080p60, 16x 1080p30 Formats: H.264, H.265, HEIF/HEIC
Camera	Up to 16 cameras, max 12 MP sensor resolution, 4x 4-lane CSI2
PCIe	2x PCIe Gen 4: 1x 2-lane + 1x 4-lane (Root Complex & Endpoint)
USB	2x USB 3.1 Gen 2, 1x USB 2.0
Networking	2x 2.5 GbE w/ TSN (SGMII)
Other I/O	21x QUP_SEs (supports UART/I2C/SPI), 149x GPIOs
Storage	2x UFS 3.1 Gen 4 2-lane, 1x 8-bit SDCC5, NVMe over PCIe
Wi-Fi/Bluetooth/WAN	Support through companion chips: QCA6698AQ, SDX35, SDX72
MCU-Like Subsystem	4x real-time cores @ 1.85 GHz 1x RGMII w/TSN, 8x CAN-FD, 5x QUP_SEs (supports UART/I2C/SPI)		Planned support for safety certification up to SIL3-capable with dedicated safety island 1x RGMII w/TSN, 8x CAN-FD, 5x QUP_SEs (supports UART/I2C/SPI)
Power (SoC only)	3.8W–20W
Operating System	Linux Yocto, Linux Ubuntu
Package	25.0 mm x 25.0 mm / 0.6 mm ball pitch
Temperature Range	-40°C to 115°C (Tj)

Inquiry / Quotation

If you have any questions about this product or would like a quote, please contact us here.

Macnica can also introduce you to development partners who provide modular SOMs (System On Modules) and evaluation boards, so please feel free to contact us.

Click here for a quote

To Qualcomm manufacturer information Top

Back to Manufacturer Information Top

Site Search