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Qualcomm Dragonwing™ Q5 Series
The Qualcomm Dragonwing™ QCS5430 processor is a scalable SoC designed for mid-range IoT, integrating high computing performance, advanced connectivity, and edge AI-powered camera capabilities. Its software-defined SKUs (Feature Packs) provide flexibility, allowing for configuration selection at the product design stage as well as future feature expansion through OTA upgrades.
This processor features wireless connectivity including Wi-Fi 6E, heterogeneous computing combining a Kryo™ CPU, Adreno™ GPU, and Hexagon™ DSP, and edge AI processing designed for multiple camera inputs. It is optimized for IoT devices in industrial and commercial applications, such as robotics, industrial handhelds, retail terminals, cameras, and drones. A lifecycle design based on a long-term supply program supports long-term product operation.
Product Specifications
|
Products |
QCS5430 |
QCS5430 |
QCS5430 |
|
Feature Pack |
Feature Pack 1 |
Feature Pack 2 |
Feature Pack 2.5 |
|
CPU |
Hex-core Kryo 670 CPU from 1.8 GHz to 2.1 GHz |
Octa-core Kryo 670 CPU from 1.8 GHz to 2.2 GHz |
Octa-core Kryo 670 CPU from 1.8 GHz to 2.4 GHz |
|
GPUs |
Qualcomm Adreno 642L GPU @ 315 MHz |
Adreno 642L GPU @ 550 MHz |
|
|
Memory/Storage |
Dual-channel, non-PoP LPDDR5/LPDDR4X SDRAM, UFS 2.x/3.1, two-lane HS gear 4, SD v3.0, eMMC 5.1 |
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|
Compute DSP |
Hexagon DSP with dual HVX and 2K HMX (~3.5 INT8 TOPS) Clock Speed 1.4 GHz |
~6 INT8 TOPS |
|
|
Connectivity |
WLAN: Wi-Fi 6 (802.11ax) & Wi-Fi 6E (6 GHz), Bluetooth 5.2 & FM supported, Uplink/Downlink MU-MIMO, 4K QAM, 160 MHz channels (5 & 6 GHz) |
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Display Technology |
Adreno 1075 DPU, On-device Display Resolution: FHD+ (1080 x 2520 pixels) 8L @ 120 fps, 1x DSI D-PHY (4-lane), DP 1.4 SST |
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Camera ISP |
Qualcomm Spectra 570L ISP, Dual Camera: 2x22 MP |
Qualcomm Spectra 570L ISP, Dual Camera: 3x22 MP |
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Video |
Up to 4K60 decode for H.264/H.265/VP Up to 4K30 encode for H.264/H.265 Support for HDR10 and HDR10+ playback |
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Audio |
Qualcomm Noise and Echo Cancellation V10, Integrated low-power VA (more keywords, Command First), Audio ML DSP: LPI, Shared 2 MB, 1.4 GHz |
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Interfaces |
USB Type-C 3.1, USB 2.0, UFS 2.x/3.1, eMMC 5.1, SD 3.0, 2x PCIe |
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Security Features |
Hardware Key Manager & ECC, Secure boot, Crypto Engine, Secure key provisioning, Qualcomm TEE, Qualcomm Content Protection (Widevine, Camera Security Framework, Secure User Interface) |
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Package |
12 mm x 14 mm; non-PoP |
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Inquiry / Quotation
If you have any questions about this product or would like a quote, please contact us here.
Macnica can also introduce you to development partners who provide modular SOMs (System On Modules) and evaluation boards, so please feel free to contact us.