Qualcomm finally releases its own branded Wi-Fi module!

Until now, Qualcomm only handled chips, so customers have had to consider introducing third-party modules. There were some circumstances where we were unable to meet schedules or prices, but Qualcomm will release its own branded modules. This allows us to provide customers with cheaper modules in a shorter period of time.
At the same time, Evaluation and Development Kit (SDK)"Also released There are also plenty of tutorials on how to use the evaluation kit, so you can start trying it out right away.
≫ For details about the "Evaluation and Development Kit (SDK)" and setup instructions, Here

Four advantages of Qualcomm modules

1. Shortening product development time/reducing human resources

Qualcomm modules have already passed major certification programs, allowing you to shorten your design cycle time and reduce manpower resources.

*Complies with TELEC, FCC, CE, IC, CA, SRRC, etc.

2. Cost-effective modules

It is possible to reduce certification costs for the final product.

BOM costs can be optimized to match Qualcomm's contract prices.

3. Multiple BOM options, multi-sources, diverse supply chains

Multi-sourcing/diversified supply chain ensures a stable supply of devices.

4. Two types of antenna configuration

Supports PCB antennas and antenna connectors.

Module lineup

Currently released are the following two types of modules for IoT applications:

・QCC730M module

    QCC730M Module is a Qualcomm microcontroller-embedded Wi-Fi product QCC730 chip Equipped with IoT connectivity Ultra-low power Wi-Fi module is.

Selectable power modes and innovative power management provide unprecedented power savings for extremely long battery life.

You can choose the antenna type (PCB/connector) and iPA/xPA.

・QCC74xM module 

    QCC74xM Module is a Qualcomm microcontroller-embedded Wi-Fi product QCC74x chip Equipped with 1x1 Wi-Fi6/Bluetooth®5.3/IEEE802.15.4 compatible
3 radio Wi-Fi module It is possible to select the antenna type (PCB/connector). SDK supports Matter and AT commands.

Ultra-low power Wi-Fi module for IoT connectivity
QCC730M Module

1x1 Wi-Fi6/Bluetooth®5.3/IEEE802.15.4 compatible, 3radio Wi-Fi module
QCC74xM Module

■ Specifications for each module

Category/ Product Name	QCC730M Module	QCC74xM Module
	For IoT connectivity Ultra-low power Wi-Fi module	1x1 Wi-Fi6/Bluetooth®5.3/IEEE802.15.4 compatible 3radio Wi-Fi module
Tips	Microcontroller built-in Wi-Fi product QCC730	Microcontroller built-in Wi-Fi product QCC74x
CPU	M4 processor with FPU @ 60 MHz 1.5 MB RRAM (600 KB for applications) 640 KB SRAM (260 KB for applications) XiP over QSPI Flash	32-bit RISC-V @ 325 MHz with DSP and FPU 128 KB ROM, 4Kb eFuse and 1/2/4KB OTP 484 KB on-chip SRAM (32 KB I-Cache and 16 KB D-Cache) 4/8/16 MB pSRAM SiP (optional) 4/8 MB NOR flash SiP (optional)
Bluetooth	-	Bluetooth 5.3
Wi-Fi	Dual-band 1x1 802.11a/b/g/n, HT20, up to MCS3	802.11b/g/n/ax
Security	Integrated hardware crypto accelerations Security services (boot, debug, provisioning, com/OTA, etc.)	Integrated hardware crypto acceleration Security services (secure boot, secure debug, etc.) PSA Certified Level One
IF/Peripherals	36 Pins SPI (slave), QSPI (master), I2C (master), UART (2-wire) Wakeup, VBAT, GND, FEM Signaling	32 and 46-pin LGA module pads SD/MCC/SF, SDIO, QSPI, SPI, I2C, I2S, UART, PWM, ADC/DAC, CAN, RMII, USB*, VDD, GND
package	36-pin LGA module package, all module variants are pin-compatible • iPA: 12.28 x 19.8 x 2.6 mm (PCB Antenna) and 12.28 x 14.8 x 2.2 mm (RF Connector) • xPA: 12.28 x 23.0 x 2.6 mm (PCB Antenna) and 12.28 x 18.0 x 2.6 mm (RF Connector)	QCC743M: 32-pin LGA module  • PCB Antenna module: 12.28 x 17.28 x 2.4 mm  • RF Connector module: 12.28 x 12.28 x 2.4 mm  • Both modules are pin-compatible QCC744M: 46-pin LGA module  • PCB Antenna module: 14.82 x 23.63 x 2.4 mm  • RF Connector module: 14.82 x 18.63 x 2.4 mm  • Both modules are pin-compatible
Temperature		-40~+85°C
Voltage		Input voltage: 2.97~3.63V I/O voltage: 1.8V/3.3V
handle Operational Mode

■ QCC730M module block diagram

QCC730M Module Block Diagram

■ QCC74xM module block diagram

QCC74xM Module Block Diagram

More releases are planned for the future.

For details on each module, please visit qualcomm.com. (QCC730M module, QCC74xM module)

development kit

Qualcomm also provides evaluation and development kits (SDKs) for each module.

The following link (Qualcomm website) provides free access to various materials such as tutorials and datasheets for each development kit, so please make use of them to set up your development kit.
(User guide, setup guide, product data sheet, open source software SDK)

QCC730M dev kit

QCC74xM dev kit

Let's create a prototype of an IoT application!

▶ Setup instructions for the QCC730 development kit are here

▶ Setup instructions for the QCC74x development kit are here

・Antenna type (PCB/connector) can be selected

・iPA/xPA selectable *QCC730

*The evaluation kit has not been certified for radio waves.

The QCC730M has multiple options for FEM/antenna type, while the QCC74xM has multiple options for internal pSRAM/external Flash/antenna type.

Please contact us to discuss the features you require.

Inquiry

If you have any questions about this product, would like to request samples, or would like documentation for evaluation or development, please contact us using the information below.