Qualcomm RB3 Gen 2 Development Kit
The Qualcomm RB3 Gen 2 Development Kit is equipped with the Qualcomm QCS6490 SoC and is a high-performance, feature-rich platform with powerful AI processing and computer vision, which can be used to develop a wide range of IoT/embedded solutions such as cameras, handheld devices, robotics, industrial equipment, and automation.
Main Features:
AI Computing Performance:Equipped with Qualcomm QCS6490, the AI accelerator architecture combines the Qualcomm Kryo 670 CPU and Qualcomm Hexagon processor to deliver 12 TOPS of AI processing power, improving inference speed, power efficiency, and the ability to run multiple networks simultaneously.
Comprehensive hardware and software:The software that corresponds to the hardware is provided as a set, making embedded development easy. The OS supports Linux and Android.
Expandability:The hardware is 96Boards compliant and supports expansion boards such as Vision Mezzanine.
Image Processing:The Vision Kit comes with a main camera and a tracking camera, and the Qualcomm Spectra ISP 570L image processing engine enables advanced image processing.
Video Processing:The Qualcomm Adreno 633 VPU provides high quality 4K video encoding/decoding capabilities, while the Adreno 1075 DPU supports 4K displays.
Wireless connection:Supports Wi-Fi 6E, providing high speed and stable wireless connection.
Development Kit Contents
hardware
Core Kit:
- Development board with Qualcomm QCS6490 processor
- 12V power cable
・USB Type-C cable
・Mini speaker
・Setup Guide
・Pick tool for switch setting
Vision Kit:
In addition to the Core Kit contents, the following accessories are included
・Mounting bracket for CSI camera
・IMX577 MIPI-CSI camera module
・OV9282 MIPI-CSI camera module
software
・Linux, Android support
・Qualcomm Intelligent Multimedia Product SDK (for Linux)
・Qualcomm Intelligent Robotics Product SDK
・Qualcomm Neural Processing SDK
・Hexagon SDK
RB3 Gen2 Core Kit / Vision Kit Product Specifications
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Core Kit |
Vision Kit (Core Kit with the following content added) |
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Chipset |
QCS6490 |
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CPU |
Octa-core Kryo 670 CPU |
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Memory(RAM) |
6 GB LPDDR4x |
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Camera |
2x C-PHY/D-PHY 30-pin expansion ports on interposer board |
1x IMX577 1x OV9282 D-PHY 1 MP with bracket, plus additional D-PHY and GMSL-capable expansion ports |
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GPUs |
Adreno 643 GPU |
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Video |
Adreno 633 VPU: 4K60 fps decode H.264/H.265/VP9 4K30 fps encode H.264/H.265 |
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Display |
Up to two displays supported concurrently: 1x Full-size HDMI connector 1x USB Type-C supporting DP alt mode 1x mini-DP connector DSI expansion |
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AI |
Up to 12 TOPS |
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WLAN/Bluetooth |
802.11ax with DBS Bluetooth 5.2 Two onboard printed antennas RF expansion connectors for optional external antennas |
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Storage(onboard) |
128 GB UFS Flash |
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Storage(external) |
1x MicroSD Card Slot, PCIe expansion for NVMe |
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PCIe |
1x PCIe Gen 3 2-lane to expansion connector, optional 1x PCIe Gen 3 1-lane to expansion connector |
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USB |
1x USB 3.0 Type-C 1x USB 2.0 w/OTG 2x USB 3.0 Type-A 1x USB 3.0 on high-speed expansion |
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Audio |
1x DMIC 2x digital audio amplifiers I2S/Soundwire/DMIC expansion on low-speed connectors |
4x DMIC 2x digital audio amplifiers I2S/Soundwire/DMIC expansion on low-speed connectors |
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Sensor |
IMU onboard (ICM-42688), additional expansion |
IMU (ICM-42688) Pressure sensor (ICP-10111) Mag sensor/compass (AK09915), additional expansion |
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OS |
Linux / Android |
Related product information
Qualcomm QCS6490
This is a high-end platform released for "IoT-related embedded system development." Equipped with an octa-core Qualcomm Kryo 670 CPU and Hexagon DSP, it provides powerful computing performance and can be used in a variety of applications, including handheld devices, tablets, drive recorders, POS systems, and HMI (human-machine interface) systems.
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Inquiry / Quotation
If you have any questions about this product or would like a quote, please contact us here.
Macnica can also introduce you to development partners who provide modular SOMs (System On Modules) and evaluation boards, so please feel free to contact us.