Silex Technology Co., Ltd. has announced a domestic wireless LAN module with a USB interface that uses a Qualcomm chip (QCA9377).
Silex will release IEEE 802.11ac x Bluetooth® wireless LAN combo module "SX-USBAC" for domestic and overseas on March 26, 2021.

 

"SX-USBAC" adopts the commonly and widely used USB 2.0 interface, and two types of modules are provided as a standard lineup: surface mount type and USB Type-A connector type. By connecting to an existing USB connector, a wide range of devices can be equipped with professional-quality wireless LAN.

Wireless certification has been obtained in Japan, the United States, Canada, and Europe, and compatible wireless LAN drivers are provided by Silex, allowing smooth product development.

press release

https://www.silex.jp/doc/PR210315_vol238_SX-USBAC.pdf

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