By employing a highly integrated 1700V-compatible PowiGaN™ single HEMT IC in a compact, thin design, we achieve space savings, simplified design, improved reliability, and an 88% reduction in BOM points.

On March 23, 2026, Power Integrations, a leader in high-voltage integrated circuits for energy-efficient power conversion, announced two new ultra-thin and compact reference designs for auxiliary power supplies for 800VDC AI data centers.

The single-output 15W design is extremely compact, measuring 30mm x 30mm and 7mm thick, while the isolated 6-output 35W design achieves a size of 80mm x 60mm and 8mm thick. These designs are specifically optimized for NVIDIA's liquid-cooled blade rack architecture, "Kyber," enabling approximately 30% space savings on ultra-high-density mounted mains power distribution boards (PDBs) and reducing the number of BOM points by approximately 30%, contributing to design simplification and overall reliability improvement. Furthermore, these designs achieve high efficiency of at least 88% across all line and load conditions.

"As the only company offering a single HEMT 1700V-compatible GaN device, Power Integrations can design best-in-class, high-efficiency flyback converters with a low BOM count while maintaining ample safety margins on an 800V bus," said Jason Yan, Senior Training Manager at Power Integrations. "The only alternative is a costly, discrete silicon carbide (SiC) device, which requires 30% more components and space to operate," he added.

A newly published design case study report describes 35W and 15W flyback auxiliary power supplies for high-voltage AI data center applications. These compact power supply units (PSUs) power internal components such as MCUs, gate drivers, and operational amplifiers, and perform critical "control and housekeeping" functions to ensure reliability, efficiency, and system safety.

Both designs are based on Power Integrations' InnoMux™-2 IC, which employs 1700V PowiGaN technology. The 1700V rated InnoMux-2 IC easily supports a nominal 1000VDC input voltage in a flyback configuration, maximizing power delivery while achieving stable high efficiency of 90% in discontinuous conduction mode (DCM).

For more details, please visit the Power Integrations website.

Design documentation related

The design documents included in this press release can be downloaded immediately from the manufacturer's website below.

• DER-1110: Designed to provide a 35W multi-output flyback PSU using the IMX2353F chip as an auxiliary power supply for high-voltage AI data centers.
• DER-1114: Designed to provide a 15W single-output flyback PSU using the IMX2353F chip as an auxiliary power supply for high-voltage AI data centers.

Inquiry / Quotation

If you have any questions about this product or would like a quote, please contact us below.