NXP Semiconductors: u-blox wireless module - NXP Semiconductors -Macnica

NXP Semiconductors Wi-Fi®+Bluetooth® IC Chip equipped u-blox wireless module products

NXP Semiconductors offers a wide range of Wi-Fi®+Bluetooth® IC chips.
We can propose modularized products using u-blox.
We have listed them in a table, so if you are interested in any of our products, please feel free to contact us.

Information is also available on the NXP website, so please take a look there as well.

Wi-Fi® + Bluetooth® Module | NXP Semiconductors

Figure 1: u-blox product lineup

Figure 1 shows the lineup of modules equipped with u-blox's NXP wireless chips.

The vertical axis represents the Wi-Fi standard, and the horizontal axis represents the breadth of product functions.

Wi-Fi6 modules are available with and without a host.

No host

　◦Wi-Fi 4, 1x1, DB： MAYA-W1

　◦Wi-Fi 5, 1x1, DB： JODY-W2

　◦Wi-Fi 6, 1x1, DB： MAYA-W2

　◦Wi-Fi 6, 2x2, CDW, DB： JODY-W3

・ Host available

　◦Wi-Fi 6, 1x1, DB：IRIS-W10

Module name	MAYA-W1	JODY-W2	MAYA-W2	JODY-W3	IRIS-W10
NXP wireless chip	IW416	88W8987	IW611/IW612	88Q9098	RW610/RW612
Wifi	Wi-Fi 4 (802.11a/b/g/n)	Wi-Fi5 (802.11a/b/g/n/ac)	Wi-Fi6 (802.11a/b/g/n/ac/ax)	Wi-Fi6 (802.11a/b/g/n/ac/ax)	Wi-Fi6 (802.11a/b/g/n/ac/ax)
data rate	Up to 150 Mbit/s	Up to 433 Mbit/s	Up to 480 Mbps	Up to 1.2 Gbps	Up to 115 Mbps
frequency band	2.4/5GHz	2.4/5GHz	2.4/5GHz	2.4/5 GHz	2.4/5 GHz
Bluetooth	Bluetooth 5.2 (BR/EDR/Low Energy)	Bluetooth 5.2 (BR/EDR/Low Energy)	Bluetooth 5.4 (BR/EDR/LE Long Range, LE Audio)	Bluetooth 5.3 (BR/EDR/LE Long Range)	Bluetooth 5.4 (LE Long Range)
Other wireless technologies	-	-	802.15.4 (Thread/Zigbee)	-	Thread
antenna	External antenna (U.FL connector, antenna pin) Internal Antennas (PCB Antenna)	External Antennas (Antenna pin)	External antenna (U.FL connector, antenna pin) Internal Antennas (PCB Antenna)	External Antennas (Antenna pin)	External Antennas (Antenna pin) Internal Antennas (PCB Antenna)
Operating temperature range	-40 °C ～ +85 °C	-40°C to +105°C (Depending on grade)	-40 °C ～ +85 °C	-40 °C ～ +85 °C	-40 °C ～ +85 °C
interface	SDIO (Wi-Fi), High-speed UART, PCM/I2S (Bluetooth)	SDIO (Wi-Fi), high-speed UART (Bluetooth), PCM (Bluetooth audio)	SDIO (Wi-Fi), high-speed UART (Bluetooth), PCM, I2S (Bluetooth audio), SPI (802.15.4)	PCIe/SDIO (Wi-Fi), high-speed UART (Bluetooth), PCM/I2S (Bluetooth audio)	USB、UART、SPI、SDIO、Ethernet RMII、I2C、I2S、GPIO
Security	WPA3, WPA2, TKIP/WPA, WEP, WAPI, AES	WPA, WAPI, WPA2, WPA3, WPS, Easy Connect	WPA3, WPA2, WAPI, WEP, AES, Secure Boot	WPA3, WPA2, WAPI, WEP, AES	WPA2/WPA3, Secure Boot, Arm TrustZone
size	10.4 x 14.3 x 1.8 mm	13.8 × 19.8 × 2.5 mm	10.4 x 14.3 x 1.9 mm	13.8 x 19.8 x 2.5 mm	14.6 x 16.8 x 2.1 mm 14.6 x 20.9 x 2.1 mm
Usage	Industrial Automation Smart Factory EV Charging Home appliances Tracking POS Building Automation Healthcare	In-Vehicle Infotainment Telematics Industrial Control	Industrial Applications Smart Factory EV Charging Building Automation Healthcare	In-vehicle and professional applications	Industrial Automation Smart Buildings Healthcare Devices POS
Other features	Up to 8 stations in AP mode, up to 16 Bluetooth Low Energy connections	Up to 8 stations in AP mode, AEC-Q100 compliant (chipset)	Industrial temperature range	2x2 MIMO, Beamforming, Dual MAC support	Dual-band Wi-Fi 6, Bluetooth LE 5.4, Thread support, built-in powerful MCU, Matter protocol support
development kit	EVK-MAYA-W161-00B EVK-MAYA-W166-00B	EVK-JODY-W263-01A	EVK-MAYA-W271-00C EVK-MAYA-W276-00C	EVK-JODY-W374-00A EVK-JODY-W377-00A	EVK-IRIS-W101 EVK-IRIS-W106 USB-IRIS-W106

Table 1: Function list of each module

Development kit and development environment

As noted in Table 1, u-blox has released a development kit for modules equipped with wireless ICs.

Here we will use JODY-W3 as an example to explain the development kit and development environment.

Overview of the JODY-W3 Development Kit (EVK-JODY-W3)

EVK-JODY-W3 is a development kit for evaluating the JODY-W3 series multi-radio modules (Wi-Fi and Bluetooth). This kit allows you to test and evaluate the Wi-Fi and Bluetooth connectivity features of the JODY-W3 series modules from an external host processor.

Main contents of the kit

system requirements

host:

For Wi-Fi access: Mini-PCIe or M.2 Key E slot (via PCIe 2.0) or Micro SDIO slot (via SDIO 3.0)

- For Bluetooth access: USB 2.0 interface (via USB-UART bridge)

operating system:

　・Linux (3.x – 6.x)

　・Android

software

JODY-W3 series modules are based on NXP 88Q9098/88W9098/AW690 chipsets. The necessary drivers and firmware are developed by NXP and integrated into the Linux BSP for NXP i.MX application processors.

Wi-Fi driver: https://github.com/nxp-imx/mwifiex
Firmware: https://github.com/NXP/imx-firmware
i.MX meta-layer: https://github.com/nxp-imx/meta-imx

Development procedure

1. Hardware setup: Connect the module board and carrier board included in the evaluation kit and provide an appropriate power supply.
2. Prepare the software: Download the latest drivers and firmware listed in the "Software" chapter and install them on the host processor.
3. Interface settings: Set jumpers and switches according to the interface you will be using (PCIe, SDIO, UART, etc.).
4. Check communication: Check that communication between the host processor and the JODY-W3 module is normal.
5. Application Development: If necessary, we will develop and test applications that utilize Wi-Fi and Bluetooth functions.

For detailed instructions and technical information, please refer to the EVK-JODY-W3 User Guide, which covers everything you need to know about how to set up the evaluation kit, interface details, jumper settings, power configuration, and more.

The JODY-W3 series and EVK-JODY-W3 evaluation kit enable the development of high-performance Wi-Fi 6 and Bluetooth 5.3 solutions.