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Product Summary
Although the flash storage market is moving towards UFS and SSD products, the embedded and industrial markets continue to adopt e.MMC products. e.MMC products incorporate NAND flash memory and its controller into the package, which frees engineers from the burden of implementing error correction codes (ECC) and managing data, making it relatively easy to use large-capacity storage.
Pearl e.MMC Key Features
- Compliant with JEDEC e.MMC Version 5.1 (JESD84-B51)
- Equipped with the latest 176-layer 3D TLC NAND for the industrial market
- Power supply voltage (Vcc): 2.7 to 3.6 V
- I/O voltage (Vccq): 1.70 to 1.95V or 2.7 to 3.6V (Dual I/O voltage)
- Unique Ultra Endurance partition
- Highly durable partition ideal for storing important logs and data
Product lineup
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e.MMC v5.1 (JESD84-B51) |
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Device capacity |
32GB |
64GB |
128GB |
256GB |
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WT (-25℃~85℃) |
MTFC32GBCAQTC-WT |
MTFC64GBCAQTC-WT |
MTFC128GBCAQTC-WT |
MTFC256GBCAQTC-WT |
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IT (-40℃~95℃) |
MTFC32GBCAQTC-IT |
MTFC64GBCAQTC-IT |
MTFC128GBCAQTC-IT |
MTFC256GBCAQTC-IT |
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User area Size (TLC) |
30,352 MB |
60,704 MB |
121,408 MB |
242,816 MB |
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Max Enhanced Area Size (SLC) |
10,112 MB |
20,224 MB |
40,448 MB |
80,896 MB |
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Max Ultra Endurance Partition Size (HE SLC) |
7,584 MB |
15,168 MB |
30,336 MB |
60,672 MB |
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Boot Partition Size (Max) |
256MB |
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Boot Partition Size (Default) |
31.5MB |
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Package (package dimensions) |
153-LFBGA (11.5mm × 13mm × 1.3mm); Ball Pad: Ø0.35 SMD |
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OnboardNAND |
Micron 176L 3D TLC NAND |
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Performance: HS400 Seq. Write/Read, Typical |
185 / 335 [MB/s] |
185 / 335 [MB/s] |
235 / 335 [MB/s] |
260 / 335 [MB/s] |
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Performance: HS200 Seq. Write/Read, Typical |
130 / 180 [MB/s] |
130 / 180 [MB/s] |
150 / 180 [MB/s] |
155 / 180 [MB/s] |
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Operating voltage(VCC; VCCQ) |
VCC=2.7-3.6V; VCCQ=1.7–1.95V or 2.7–3.6V (Dual I/O Voltage) |
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Application example
The following applications are examples of Micron's e.MMC products being considered and adopted:
・Industrial equipment: industrial PCs, single board computers, automatic transport equipment, factory automation (FA), PoS terminals, handheld terminals, IoT devices, intelligent edge devices, etc.
・Communication equipment: network switches, routers, network monitoring devices, base stations, etc.
・Imaging equipment: surveillance cameras, smart cameras, web cameras, broadcasting equipment, video equipment, image recognition equipment, etc.
・Office equipment: copiers, multifunction machines, printers, PC peripherals, etc.
・Consumer devices: TVs, set-top Box (STBs), home automation, digital video cameras (DVCs)/digital still cameras (DSCs), AR/VR devices, etc.
・In-vehicle equipment: Advanced driver assistance systems (ADAS), dashboards/clusters, in-vehicle infotainment (IVI), drive data recorders, in-vehicle gateways, body control modules (BCM), etc.
Inquiry
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