■ ProASIC3, ProASIC3E

・Low power consumption and space saving

Ideal for applications such as portable equipment.

- Low power consumption due to non-volatile process

- Reduces power consumption by up to 50% compared to competing FPGAs

- Eliminate extra BOM costs such as fans and heat sinks

- Save space and reduce BOM cost by not requiring configuration ROM

・Instant ON

　　　Perfect for responsive applications.

- Immediate startup without configuration unlike SRAM FPGA

・High reliability with strong soft error tolerance

Suitable for high altitude and high reliability applications.

- Neutron radiation effects not detected

・Automotive T and military M temperature grades

　　　Suitable for automotive applications.

- Grade 1: –40°C to 125°C TA (135°C TJ)

- Grade 2: –40°C to 105°C TA (115°C TJ)

　　　Perfect for military applications.

- M grade: –55°C to 125°C TJ

■ ProASIC3 nano (nano)

・ Small package

Ideal for anti-vibration applications and small enclosures.

- Minimum 6 × 6 mm package

■ ProASIC3L (L)

・Even lower power consumption than ProASIC3/E

Ideal for battery-powered applications, etc.

- Dynamic Power Consumption -40%, Static Power Consumption -50%

- Flash*Freeze technology shuts off dynamic power instantly