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Automotive IGBT Power Module Product Overview

Infineon offers a portfolio of IGBT power modules that can be considered for a wide range of applications for hybrid and electric vehicles, such as traction inverters, on-board chargers, auxiliary inverters, HV/LV DC-DC converters, fuel cell air compressors and DC-DC boosters.

The portfolio of automotive IGBT power modules includes the HybridPACK™ and EasyPACK™ families with state-of-the-art IGBT technologies such as EDT2, which provide superior efficiency and high reliability, as well as state-of-the-art double-sided cooling (DSC) packages. Automotive IGBT power modules cover power classes from 30kW to 180kW and are available in half-bridge, 4-pack and 6-pack power semiconductor configurations. They are optimized for direct water cooling, simplifying design and manufacturing.

Designed based on state-of-the-art Si IGBT technology, these power modules maximize efficiency with high voltage performance, fast switching, low switching losses, and a high level of integration in a compact module. Compliant with AQG 324, they offer high mechanical robustness and ease of use in design and manufacturing.

Product features

  • Extremely low conduction losses
  • Press-Fit Signal Pins
  • Preparation of application guide for implementation
  • Capable of switching operation at maximum Tvj=175°C
  • Extensive module portfolio
  • Press-fit for easy installation

Lineup of automotive IGBT power modules


The products introduced on this page are only those that have already been released. There are also new products currently under development, so please contact us using the information below.

650V withstand voltage (4-pack module)

Products IC(nom) / IF(nom) [A] VCE(sat) Tvj=25°C typ [V] Housing Features
F4-50R07W1H3_B11A 50 1.5 EasyPACK™ 1B PressFIT

650V withstand voltage (6-pack module)

Products IC(nom) / IF(nom) [A] VCE(sat) Tvj=25°C typ [V] Housing Features
FS75R07W2E3_B11A 75 1.45 EasyPACK™ 2B PressFIT
FS50R07W1E3_B11A 50 1.45 EasyPACK™ 1B PressFIT

700V withstand voltage (half-bridge dual module)

Products IC(nom) / IF(nom) [A] VCE(sat) Tvj=25°C typ [V] Housing Features
FF400R07A01E3_S6 400 1.65 HybridPACK™ DSC Double Side Cooled

700V withstand voltage (6-pack module)

Products IC(nom) / IF(nom) [A] VCE(sat) Tvj=25°C typ [V] Housing Features
FS200R07A02E3_S6 200 1.45 HybridPACK™ DSC Double Side Cooled

750V withstand voltage (half-bridge module)

Products IC(nom) / IF(nom) [A] VCE(sat) Tvj=25°C typ [V] Housing Features
FF300R08W2P2_B11A 300 1 EasyPACK™ 2B PressFIT

750V withstand voltage (half-bridge dual module)

Products IC(nom) / IF(nom) [A] VCE(sat) Tvj=25°C typ [V] Housing Features
FF450R08A03P2 450 1.2 HybridPACK™ DSC Double Side Cooled

750V withstand voltage (6-pack module)

Products IC(nom) / IF(nom) [A] VCE(sat) Tvj=25°C typ [V] Housing Features
FS1150R08A8P3LBC 1150 1.08 HybridPACK™ Drive G2 PinFin Base Plate
Long Tabs w/ hole
FS1150R08A8P3LMC 1150 1.08 HybridPACK™ Drive G2 PinFin Base Plate
Long Tabs w/o hole
FS950R08A6P2B 950 1.1 HybridPACK™ Drive Performance Baseplate
Short Tabs
FS950R08A6P2LB 950 1.1 HybridPACK™ Drive Performance Baseplate
Long Tabs
FS820R08A6P2B 820 1.1 HybridPACK™ Drive PinFin Baseplate
Short Tabs
FS820R08A6P2LB 820 1.1 HybridPACK™ Drive PinFin Baseplate
Long Tabs
FS770R08A6P2B 770 1.1 HybridPACK™ Drive Wave Baseplate
Short Tabs
FS770R08A6P2LB 770 1.1 HybridPACK™ Drive Wave Baseplate
Long Tabs
FS660R08A6P2FB 660 1.1 HybridPACK™ Drive Flat Baseplate
Short Tabs
FS660R08A6P2FLB 660 1.1 HybridPACK™ Drive Flat Baseplate
Long Tabs
FS650R08A4P2 650 1.1 HybridPACK™ DC6i Wave baseplate

1200V withstand voltage (6-pack module)

Products IC(nom) / IF(nom) [A] VCE(sat) Tvj=25°C typ [V] Housing Features
FS380R12A6T4B 380 1.6 HybridPACK™ Drive PinFin Baseplate
Short Tabs
FS380R12A6T4LB 380 1.6 HybridPACK™ Drive PinFin Baseplate
Long Tabs

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Infineon's automotive lineup

Among Infineon's wide-ranging portfolio of products, we have compiled a lineup of only automotive-grade products that have been certified to AEC-Q100/AEC-Q101.
We have many products that can be considered for a variety of applications, including microcontrollers, power semiconductors, memory, and sensors, so please take a look.

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