Macnica to exhibit at Power Device & Module EXPO

We Power AI -- From the Grid to the Core

Infineon will exhibit at the Power Device & Module Expo, which will be held at Tokyo Big Sight from Wednesday, January 21, 2026 to Friday, January 23, 2026.

Rapid advances in artificial intelligence (AI) applications are significantly increasing the energy demands of data centers, posing a paramount challenge: increasing the scalability of AI technology while maintaining environmental responsibility.

At the exhibition, Infineon will be showcasing a wide range of solutions to address this challenge.

He will also be giving a special lecture at the Power Device & Module EXPO.
Don't miss it!

For an overview of Infineon at the Power Device & Module Expo, click here.

Advance registration is required to attend.

When attending, you must register in advance on the official website.
Register herePlease go.
_{*Those under the age of 18 cannot register.}

Overview of the event

Event name: Power Device & Module EXPO

Date and time: 2026/1/21 (Wed) - 1/23 (Fri)

Venue: Tokyo Big Sight East Hall 7

Pre-registration: Required

Special lecture: Data centers supporting the AI era and power supply in the 1 MW era

Lecture time: Friday, January 23, 2026 12:30-13:40

Title: The 1MW Era: Evolving AI and the Future of Power Supply

The spread of generative AI is causing a surge in power demand in data centers. This presentation will introduce the latest information on high-voltage direct current (HVDC) power supplies for 1 MW-class racks, as well as evolving power supply models, including next-generation technologies such as solid-state transformers (SSTs) and solid-state circuit breakers (SSCBs).

Special lecturer

Infineon Technologies Japan Co., Ltd.
Consumer, Computing & Communications Business Unit Technical Marketing Department
Senior Director Tatsuya Urakawa

Exhibition overview

Infineon power devices and modules that improve power conversion efficiency inAI power supply will be exhibited

SSCB (Solid State Circuit Breaker) Solutions Using New SiC JFETs
Compatible with DC 1500 V grids XHP™ 2 2.3kW SiC
Latest IGBT module Easy C series
Latest Power Module Solutions and Press Pack IGBTs
The world's first 300 mm GaN wafer
12kW PSU Reference Design for AI Data Centers and Servers
3 kW DC-AC Board for Single-Phase String Inverter with High-Voltage CoolGaN™ Bidirectional Switch
13 kW Vienna Topology PSU Evaluation Board with High-Voltage CoolGaN™ Bidirectional Switch
Low-Voltage CoolGaN™ Bidirectional Switch, Driver and Peripheral Components Evaluation Kit
Class-D Audio Reference Board with 100 V CoolGaN™ Transistors
PSOC™ Control C3 MCU + CoolGaN™ Dual Motor Demo
22 kW Single Stage OBC Reference Design

Register here