Flash+RAM MCP Gen 2 combines SEMPER™ NOR Flash and HYPERRAM™ 2.0 in a single package for a high performance, low pin count solution. HYPERBUS™ MCP Gen 2 improves performance and reliability over its predecessor and adds an octal interface option. This MCP combination is ideal for applications requiring bootcode storage or extended RAM.

PSoC™ 4100S Max expands the scalable PSoC™ 4 microcontroller lineup to offer more Flash and GPIOs, while introducing next-generation CAPSENSE™ technology, 5th Generation CAPSENSE™. These advances enable higher performance, lower power consumption, and lower development costs for Human Machine Interface (HMI) applications. The PSoC™ 4100S Max microcontroller takes products to the next level by combining rich peripherals and cryptographic accelerators.

Automotive PSoC™ 4 MCUs are a scalable, reconfigurable platform architecture for programmable embedded system controller products with Arm® Cortex®-M0+ CPUs and are AEC-Q100 compliant. It combines programmable and reconfigurable analog and digital blocks with flexible automatic wiring. Based on this platform, the PSoC™ 4700S Plus product family is the industry's first microcontroller to combine inductive and capacitive sensing technologies on a single chip.

The TRAVEO™ T2G family is the perfect choice for connected cars due to its excellent features. The CYT2BL series MCUs are designed for automotive body electronics and combine processing power and network connectivity with Arm® Cortex®-M4F. Suitable for automotive body applications such as body control modules, HVAC, and lighting.

The XMC7000 industrial microcontroller portfolio is manufactured using 40nm process technology and offers single or dual cores with Arm® Cortex®-M7 and Arm® Cortex®-M0+ operating at 350MHz.
With a comprehensive set of advanced peripherals, competitive security features, -40°C to 125°C operating temperature range, and low power modes up to 8 μA, the XMC7000 is well suited for industrial applications. The XMC7000 is equipped with peripherals such as CAN-FD, Timer/Counter/Pulse Width Modulator (TCPWM) and Gb Ethernet to provide high flexibility and added value. The XMC7200 features Gb Ethernet to provide a reliable connection for real-time Ethernet communication and always-on applications.
The XMC7000 offers 17 part numbers in four package and pin combinations to meet flexible design requirements. The XMC7000 family is ideal for motor control, digital power conversion, and I/O applications.

DF4-19MR20W3M1HF_B11 is the first 2000 V CoolSiC™ MOSFET power module in an EasyPACK™ 3B package. It increases power density in 1500 V DC applications and reduces total system cost while providing a simpler solution and fewer components.
The DF4-19MR20W3M1HF_B11 is a 4-chopper configuration in an Easy 3B package with the latest CoolSiC™ M1H generation. The 2000 V SiC MOSFET has the same performance and benefits as the 1200 V M1H series, but with a 12% lower RDSon at 125°C and greater flexibility due to a wider gate-source voltage range, a maximum junction temperature Tvjop of 175°C, and a smaller size. Realize the chip size.

The 950V CoolMOS™ PFD7 family is an innovative superjunction technology for high-voltage power MOSFETs with integrated fast body diodes suitable for lighting and industrial SMPS. This new series is designed for use in multiple topologies.

The NAC1080 is an NFC tag-side controller with NFC connectivity, a full bridge for motor control, security features and optimized energy harvesting. Enable single-chip solutions to build smart actuators controlled by mobile phones that are as small and battery-free as passive locks.

The 2EDL8x2XG3C are high-side/low-side drivers designed for advanced switching converters such as telecom and datacom applications. The 2EDL802xG3C have independent inputs with built-in hysteresis for noise immunity, and the 2EDL812xG3C have differential inputs with built-in hysteresis for noise immunity. The 2EDL812x's inherent shoot-through protection feature provides high system robustness. The driver comes in a 3X3 SON small package with standard pinout.

The TLD7002-16ES is a 16-channel linear current sink (LCS) LED driver IC with a protected integrated output stage. Designed to control LEDs with currents up to 76.5 mA per channel. Power stages can be configured in parallel to handle higher load currents. 16 independent individual PWM settings are possible. A fast writing interface is used for device OTP programming, configuration, control and diagnostic feedback.

Infineon presents the first expansion of its innovative source-down technology concept. The new products with source-down double-sided cooling in a PQFN package (3.3 x 3.3 mm) will start at 25 V and will extend the product range to 150 V, all of which will be released later this year.
Source-down technology provides many advantages at the device and system level by flipping the silicon die inside the product upside down. The source electrode is connected to the PCB instead of the drain potential being connected to the PCB on the thermal pad. Source-down offers many advantages over current solutions, including improved thermal performance, improved power density, and optimized layout.

The new 40 V StrongIRFET™ 2 power MOSFET is Infineon's latest generation MOSFET technology for a wide range of applications such as power tools and garden supplies, battery protection, energy storage systems and SMPS. These products are suitable for slow and fast switching frequencies. This new family complements the well-established StrongIRFET™ MOSFETs and offers higher performance options.

Expanded SPOC™+2 multi-channel high-side switch lineup: Same feature set and full family compatibility as existing *-ESA products, but with new low voltage concept and switch-on behavior after low voltage shutdown correspondence. It eliminates the power supply voltage drop recovery time tDELAY (UV) and supports power distribution applications such as replacing fuses and relays and supplying power to ECUs/sensors. The SPOC™ +2 family offers even more partitioning opportunities for all kinds of domain and zone applications.

This is a spec-down version of the BGT60LTR11AIP radar sensor. Standard/maximum detection range of 5/7 meters in autonomous mode, but 4/6 m with this chip. The operating temperature range has been lowered from -20°C to +85°C to -10°C to +70°C.
The BGT60LTR11SAIP MMIC is a fully integrated microwave motion sensor with integrated antenna package (AIP) plus motion detector and motion direction detector. State machines allow devices to operate autonomously without an external microcontroller or signal processing. The MMIC has four quad-state input pins, allowing flexibility in performance parameters even in autonomous mode. There are 16 levels of detection threshold (sensitivity), and the detection range can be set from 0.5 m to 6 m with a typical radar reflection cross section (RCS) for human targets. In addition, in autonomous mode, the retention time can be set in 16 steps so that the detection state can be maintained from 0.1 seconds to 30 minutes. The device achieves less than 2 mW power consumption with an adjustable duty cycle.

The extremely low self-noise digital XENSIV™ MEMS microphone IM73D122 is designed for applications requiring very high signal-to-noise ratio (low self-noise) and sensitivity. Flat frequency response (20 Hz low frequency roll-off) and tight manufacturing tolerances improve performance in multi-microphone (array) applications. The microphone uses Infineon's new shielded dual-membrane MEMS technology to achieve high environmental resistance (IP57) at the microphone level.
The powerful combination of very high signal-to-noise ratio and high sensitivity enables high-quality voice capture in voice user interface applications such as laptops, tablets and conference equipment.

High accuracy miniature coreless magnetic sensor with integrated current path for AC and DC measurements. Produces an analog output proportional to the measured current value. In addition, two digital outputs allow overcurrent detection. It uses Infineon's proven and robust monolithic Hall technology for the measurement of magnetic fields generated by electric currents, resulting in high accuracy and high linearity. With a wide measurement range of up to ±120 A, it senses current without the adverse effects of hysteresis and saturation that plague core-based sensors.

The AIROC™ CYW20819 dual-mode Bluetooth® SoC uses the market-proven AIROC™ Bluetooth® and Bluetooth® LE family of SoCs. The CYW20819 provides ultra-low power, high-performance wireless connectivity for various IoT applications. The CYW20819 SoC enables reliable Bluetooth® and Bluetooth® LE connectivity and complies with the 5.2 core specification. With its built-in Arm® Cortex®-M4 processor, the CYW20819 SoC provides high-performance computing suitable for various applications. The CYW20819 SoC is a highly integrated chip with multiple serial interfaces, PWM, etc.

The AIROC™ CYW20820 dual-mode Bluetooth® System-on-Chip (SoC) is a high-performance arithmetic function equipped with an Arm® Cortex®-M4 processor and a floating point arithmetic unit, and has core specifications that comply with Bluetooth Core Spec 5.2. Highly integrated device with high transmit power and built-in flash, multiple serial interfaces, PWM and more. The CYW20820 provides ultra-low power, high-performance wireless connectivity for various IoT applications. The CYW20820 SoC enables reliable Bluetooth® and Bluetooth® LE connectivity and complies with the 5.2 core specification. With its built-in Arm® Cortex®-M4 processor, the CYW20819 SoC provides high-performance computing suitable for various applications. The CYW20820 SoC is a highly integrated chip with multiple serial interfaces, PWM, and more.
AIROC™ CYW20820 is powered by ModusToolbox™ software

The EVAL-S25HL512T, also known as the SEMPER-S25HL512T memory module, is a low cost Pmod compatible memory module incorporating 512Mb, 3.3 V, SEMPER™ NOR Flash memory. This memory module enables quick and easy integration of SEMPER™ NOR Flash into any development kit.