Infineon Introduces Industry's First AEC-Q103 Compliant High-Performance XENSIV™ MEMS Microphone for Automotive Applications
16 April 2021, Munich (Germany)
Infineon Technologies (FSE: IFX / OTCQX: IFNNY) today announced the launch of the XENSIV™ IM67D130A. The new device combines Infineon's automotive industry expertise with its technology leadership in high-end MEMS microphones to meet the needs of high-performance, low-noise MEMS microphones for automotive applications. The XENSIV™ IM67D130A is the first automotive-quality microphone on the market that simplifies automotive application development and reduces risk during certification.
AEC-Q103 Compliant Infineon XENSIV™ MEMS Microphone IM67D130A
The microphone has an operating temperature range of -40°C to +105°C, making it versatile even in harsh automotive environments. And with a high acoustic overload point (AOP) of 130dB SPL (sound pressure level), you can capture distortion-free audio signals even in loud environments. This allows it to be installed both inside and outside the vehicle. The IM67D130A is ideal for in-vehicle applications such as hands-free systems, emergency calls, in-vehicle communications, and active noise canceling (ANC), as well as exterior applications such as sirens and road detection. This makes it possible to use sound as a complementary sensor for advanced driver assistance systems and predictive maintenance.
A high SNR (signal-to-noise ratio) of 67dB and very low distortion levels provide optimal voice quality and superior voice intelligence for speech recognition-based applications. In addition, the microphone has good sensitivity matching and optimizes beamforming algorithms for multi-microphone arrays. The XENSIV™ MEMS microphone IM67D130A is compliant with the automotive AEC-Q103-003 standard.
The XENSIV™ MEMS microphone IM67D130A comes in a PG-LLGA-5-4 package.
For details, please refer to the manufacturer page below.