November 2018 No. 1 new product information released

Regarding the agenda, it is as follows.

For details, please refer to the attached document.

agenda

  • TRENCHSTOP™ Feature IGBT: IGBT series with protection function for IH equipment
  • 600V CoolMOS™ CFD7: High Voltage Superjunction MOSFET
  • CIPOS™ Maxi
  • Infineon® eco-blocks: solder joint technology
  • Infineon® Prime Blocks: Solder Bonding Technology
  • TLD5190QU: Synchronous MOSFET full-bridge DC/DC controller with built-in protection
  • TLD5541-1QU: Synchronous Full-Bridge DC/DC Controller with SPI Interface
  • TLE5501 E0002: magnetic sensor
  • AUIR3242S: High-side gate driver for 12V power distribution applications
  • Lite SBC (System Base Chip) Family
  • TLE9104SH: smart 4-channel low-side switch with smart power technology
  • MIPI 2.0 interface control SP6T, SP8T RF switches: BGS16MA12, BGS18MA12, BGS18MA14
  • SPOC™+2 family: SPI multi-channel high-side driver with diagnostics and built-in protection

 

For details, please refer to the following materials.