November 2018 No. 1 new product information released
Regarding the agenda, it is as follows.
For details, please refer to the attached document.
agenda
- TRENCHSTOP™ Feature IGBT: IGBT series with protection function for IH equipment
- 600V CoolMOS™ CFD7: High Voltage Superjunction MOSFET
- CIPOS™ Maxi
- Infineon® eco-blocks: solder joint technology
- Infineon® Prime Blocks: Solder Bonding Technology
- TLD5190QU: Synchronous MOSFET full-bridge DC/DC controller with built-in protection
- TLD5541-1QU: Synchronous Full-Bridge DC/DC Controller with SPI Interface
- TLE5501 E0002: magnetic sensor
- AUIR3242S: High-side gate driver for 12V power distribution applications
- Lite SBC (System Base Chip) Family
- TLE9104SH: smart 4-channel low-side switch with smart power technology
- MIPI 2.0 interface control SP6T, SP8T RF switches: BGS16MA12, BGS18MA12, BGS18MA14
- SPOC™+2 family: SPI multi-channel high-side driver with diagnostics and built-in protection
For details, please refer to the following materials.