FLEX-BX200 is a box-type PC that can be equipped with multiple accelerators for AI.

Product Summary

  • Chipset: Intel® Q370
  • Socket: LGA1151
  • CPU: Intel® Core™ i7/i5/i3 or Xeon® E-2176G
  • Memory: DDR4 DIMM x 2 (Max. 64GB)
  • Storage: Removable HDD bay x 4 (Hot-swap supported), RAID 0/1/5/10 configurable
  • Interfaces: HDMI, GbE x2, USB 3.2 x 6, RS-232 x 2, Audio
  • Expansion Slots: PCIe 3.0(x8) x 2, PCIe 3.0(x4) x2, M.2 2280 x4, NVMe™ SSD x 2
  • QTS-Gateway support

interface

 

front back

HDD bays and PCIe slots

4 HDD Bay PCIe cards supporting RAID 2(x16) + 2(x4) slots

External dimensions

Product spec

Specification item Brief description
form factor  
SBC form factor ●8th Generation Intel CoreTM i7/i5/i3 porcessors in the LGA1151
●Intel® 300 Series Chipsets Q370
● FLEX AI Modular Box type PC
system  
Cooling method/cooling fan ●System fans
drive bays 4 x Accessible 2.5” SATA 6Gb/s HDD/SSD bays (RAID 0/1/5/10 support)
I/O interface  
I/O port 1 x HDMI output
2xGbE LAN
●6 x USB 3.0 Type-A
●2 x RS-232 DB-9 type
●1 x Mic-in
●1 x Line out
●1 x AC power in Inlet
Indicator & Button  
button ●Power button with power LED (power on=Blue)
●AT/ATX mode switch
●Reset button
power supply ●12V DC input only (DC jack)
●Support AT/ATX mode
Operating environment  
operating temperature -20°C ~ 50°C (with SSD and TDP 65W processor)
-20°C ~ 40°C (with HDD or add-on cards without fan)
humidity ●5% ~ 95% (non-condensing)
External dimensions  
External dimensions ●357mm x 230mm x 88mm
weight  
weight ● 4kg
expansion slot  
expansion slot 2 x PCIe 3.0 by 8 (by 16 slots)
2 x PCIe 3.0 by 4 (maximum card size supported: 68mm x 167mm)
Color  
Color ●Black C

data sheet download

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