FLEX-BX200 is a box-type PC that can be equipped with multiple accelerators for AI.
Product Summary
- Chipset: Intel® Q370
- Socket: LGA1151
- CPU: Intel® Core™ i7/i5/i3 or Xeon® E-2176G
- Memory: DDR4 DIMM x 2 (Max. 64GB)
- Storage: Removable HDD bay x 4 (Hot-swap supported), RAID 0/1/5/10 configurable
- Interfaces: HDMI, GbE x2, USB 3.2 x 6, RS-232 x 2, Audio
- Expansion Slots: PCIe 3.0(x8) x 2, PCIe 3.0(x4) x2, M.2 2280 x4, NVMe™ SSD x 2
- QTS-Gateway support
interface
front back
HDD bays and PCIe slots
4 HDD Bay PCIe cards supporting RAID 2(x16) + 2(x4) slots
External dimensions
Product spec
Specification item | Brief description |
form factor | |
SBC form factor | ●8th Generation Intel CoreTM i7/i5/i3 porcessors in the LGA1151 ●Intel® 300 Series Chipsets Q370 ● FLEX AI Modular Box type PC |
system | |
Cooling method/cooling fan | ●System fans |
drive bays | 4 x Accessible 2.5” SATA 6Gb/s HDD/SSD bays (RAID 0/1/5/10 support) |
I/O interface | |
I/O port | 1 x HDMI output 2xGbE LAN ●6 x USB 3.0 Type-A ●2 x RS-232 DB-9 type ●1 x Mic-in ●1 x Line out ●1 x AC power in Inlet |
Indicator & Button | |
button | ●Power button with power LED (power on=Blue) ●AT/ATX mode switch ●Reset button |
power supply | ●12V DC input only (DC jack) ●Support AT/ATX mode |
Operating environment | |
operating temperature | -20°C ~ 50°C (with SSD and TDP 65W processor) -20°C ~ 40°C (with HDD or add-on cards without fan) |
humidity | ●5% ~ 95% (non-condensing) |
External dimensions | |
External dimensions | ●357mm x 230mm x 88mm |
weight | |
weight | ● 4kg |
expansion slot | |
expansion slot | 2 x PCIe 3.0 by 8 (by 16 slots) 2 x PCIe 3.0 by 4 (maximum card size supported: 68mm x 167mm) |
Color | |
Color | ●Black C |
data sheet download
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