Macnica concludes a sales expansion support agreement with DSP Concepts, which provides the audio development platform "Audio Weaver" - Achieving a significant reduction in the audio device development period -

Macnica (headquarters: Yokohama, Kanagawa Prefecture; Representative Director and President: Kazumasa Hara; hereinafter "Macnica) is pleased to announce that it has signed a sales expansion support agreement with DSP Concepts, Inc. (headquarters: California, USA; CEO: Chin Beckmann; hereinafter "DSP Concepts"), provider of the audio development platform "Audio Weaver," which is bringing about a revolution in audio processing development.

With the rapid evolution of audio processing technology, advanced audio processing is now being incorporated into all electronic devices. At the same time, audio processing technology has become more complex, and development times are becoming longer. Macnica has begun selling Audio Weaver, an audio development platform that allows design using an intuitive GUI and enables implementation on actual embedded processors without the need for programming. This makes the entire design workflow faster and easier, contributing to users' time to market in product development.

■ Basic Concepts of Audio Weaver

Audio Weaver revolutionizes the conventional audio design process. In the conventional design process, various audio processes are programmed in C or other languages, and then optimized and implemented for the target processor. However, with Audio Weaver, audio processes can be designed using a GUI, and since Audio Weaver provides an optimized library for implementation on the target processor, users do not need to carry out any extra optimization work.

Also, Audio Weaver supports major processors, so even if you change the target processor in the future, it will be very easy to change.

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https://www.macnica.co.jp/business/semiconductor/manufacturers/dsp_concepts/products/143296/

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