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*This article is a Japanese translation of a Bourns press release by Macnica.
We have announced the SRP2008DP series of high-current shielded power inductors for compact and high-density designs.
Riverside, California – April 2, 2026 – Bourns, a leading manufacturer of electronic components for power, protection, and sensing solutions, announced the new SRP2008DP series of high-current shielded power inductors, designed for high-current applications pushing the limits of board space efficiency. Featuring a metal alloy powder core and offered in a slim 0.8mm thick package, the series delivers the high saturation current performance required for high-power-density DC-DC converter designs while minimizing the board layout constraints often associated with this performance level.
In consumer electronics, IoT devices, and small industrial equipment, power density requirements continue to rise, forcing designers to constantly trade off inductor performance and physical size. In increasingly high-density mounting layouts, there are growing concerns that radiated noise and signal quality degradation due to interference between adjacent components can lead to decreased system reliability and increased difficulty in achieving EMC compliance. Shielded magnetic components are effective in mitigating these risks, but they have traditionally tended to occupy a larger board area than unshielded components. The SRP2008DP series directly addresses these challenges with its metal alloy powder core design and compact size.
"As electronic systems become more sophisticated and smaller, the components used within them are required to evolve in a similar way. The Bourns® SRP2008DP series provides designers with the safety, signal quality, and standards compliance benefits of shielded high-current inductors without sacrificing layout." — Craig Wedley, Engineering Director, Magnetic Products, Bourns
Main features
- The shielding structure confines magnetic flux, reducing radiated noise that interferes with adjacent circuits and supporting EMC compliance at the board level.
- The metal alloy powder core has high resistivity, suppressing eddy currents and reducing core losses at high switching frequencies, thus maintaining signal quality in noise-sensitive designs.
- By suppressing magnetic flux leakage, magnetic coupling with surrounding wiring and components is minimized, reducing the risk of interference in high-density mounting layouts.
- High saturation current performance is ensured across the entire operating range, preventing core saturation even under load.
- A slim 0.8mm thick package, suitable for designs with height restrictions.
- It supports a wide operating temperature range of -40°C to +125°C, making it usable even in harsh thermal environments.
- RoHS compliant, halogen-free
Electrical characteristics
The SRP2008DP series covers an inductance range of 0.24µH to 4.70µH, a heating current (Irms) range of 1.10A to 3.50A, and a saturation current (Isat) range of 1.60A to 5.50A. With a footprint of 2.0 x 1.6mm, it is designed for easy integration into compact power conversion circuits with minimal wiring modifications.
|
series |
Size [mm] |
Inductance [μH] |
Irms [A] |
Isat [A] |
|
SRP2008DP |
2.0 × 1.6 × 0.8 |
0.24 ～ 4.70 |
1.10 ～ 3.50 |
1.60 ～ 5.50 |
Main use
- DC-DC converter for portable and handheld devices
- Small consumer electronics and wearable devices
- IoT modules and compact industrial power supply circuits
- Shielded magnetic components are required, and the PCB base design has height limitations.
Supply status
The SRP2008DP series is currently available for purchase.
For more details, please visit the Bourns website.
product page
For more information on SRP2008DP, please visit the Bourns page.
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