Product Summary
Compact Matrix integrated fanless embedded computers and IoT gateways are designed to enhance the responsiveness and durability of edge AI and edge computing applications. Designed for performance and durability, it delivers performance, easy integration, and robustness to enable timely, data-driven decision making.
11th generation Intel® Core™ i5/i3 and Celeron® (Tiger lake) model
AMP-300-TGL / AMP-500-TGL series <Preliminary>
Equipped with 11th generation Intel® Core™ i5/i3 and Celeron® BGA SoC processor
Supports up to 32 GB DDR4 SODIMM
Rich I/O: GbE (+1) / COM / USB / HDMI ports
Compact size: 211 (W) x 115 (D) x 35 (H) mm
*Specifications are preliminary and subject to change.
high performance
MXE-5600 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3, 8th Gen Intel® Core™ i5 BGA Processors and Mobile Intel® CM246 Chipset
- Dual SODIMM for up to 32 GB DDR4 non-ECC/ECC memory
- Rich I/O: 2x DP++ / HDMI / 2x GbE / 6x COM / 8-ch DI / 8-ch DO / TPM2.0
- USB 3.1 Gen2 x2, USB 3.1 Gen1 x2, USB 2.0 x4
- Abundant Storage: Two 2.5" SATA 6 Gb/s, CFast, M.2 2280
- Embedded Expansion: Mini PCIe, M.2 3042, USIM x2
- Front accessible I/O and adaptive function module v.2 option
value family
MVP-5100 Series
- Equipped with 9th Gen Intel® Core™ i7/i5/i3 and 8th Gen Intel® Celeron® LGA Processors
- Dual SODIMM for up to 32GB DDR4 non-ECC/ECC memory
- Rich I/O: 2x DP++ / DVI / VGA / 3x GbE / 4x COM / 8-ch DI / 8-ch DO / TPM2.0
- USB3.1 Gen2 x2, USB3.1 Gen1 x1, USB2.0 x3
- Abundant Storage: Two 2.5" SATA, CFast, M.2 2280
- Embedded Expansion: Mini PCIe / M.2 3042 / 2 USIMs
- Front accessible I/O and adaptive function module v.2 option
datasheet download
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