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Evolving thermal management: New options beyond the limits of design
In recent years, as electronic devices become more compact and perform better, heat countermeasures have become an important theme in product design. Many engineers are working to dissipate heat using conventional methods such as circuit design and heat sinks, but there are an increasing number of cases where sufficient effects cannot be achieved due to design freedom and space constraints.
To address these issues, graphite sheets have been attracting attention as a new option that combines high thermal conductivity and flexibility. We have previously introduced the features of graphite sheets, including the WE-TGFG series from Würth Elektronik, but it is also true that there was a lack of data showing the actual effect of "can they really dissipate heat?"
Therefore, we conducted a heat dissipation experiment in an environment simulating an actual case to verify the heat suppression effect of the WE-TGFG series. In this article, we will introduce the results in detail and clarify the capabilities of graphite sheets through experimental data that showed that the temperature rise was suppressed by up to 6°C.
Graphite thermal sheet with both high thermal conductivity and flexibility: WE-TGFG series
Würth Elektronik's WE-TGFG series is a high-performance graphite-based thermal conductive sheet that has a high in-plane thermal conductivity of up to 400 W/m・K, enabling efficient diffusion and dissipation of heat inside electronic devices.
The features of this series are as follows:
-Thermal conductivity: 400 W/(m・K)
Electrical insulation: 1kV/mm
・Hybrid Solutions: Can be used as a gap filler or heat spreader
- Standard lineup of thicknesses from 2 to 20 mm suitable for a wide range of applications
- Size, shape, etc. can be customized
・Replacement with conventional silicone fillers for heat dissipation
These characteristics allow it to flexibly accommodate complex housing structures and narrow spaces that were difficult to accommodate with conventional silicon-based heat dissipation materials, achieving both heat diffusion and heat dissipation. The WE-TGFG series is also intended to be sandwiched between heat-generating components and housings to efficiently diffuse and dissipate heat. In particular, its flexibility and thermal conductivity are highly effective in configurations where the housing itself is used as a heat dissipation path.
In this experiment, we verified the heat dissipation effect of the WE-TGFG series in a configuration that mimicked the actual usage environment.
Thermal performance verification in a simulated housing environment
The purpose of this experiment was to verify the degree of heat dissipation effect that the WE-TGFG series graphite sheet would provide in an actual housing structure.
Purpose of the experiment
・Check whether heat dissipation through the case is possible by using WE-TGFG
・Quantitatively evaluate the effect of suppressing temperature rise under conditions close to the actual usage environment
Experimental environment
・The power supply module board used is 24V 2A.
・Operate this board as a heat source and observe the temperature change using a thermal camera.
The experiment was carried out with the WE-TGFG sheet attached to the substrate (see Figure 2), and a metal plate placed on top of it.
・The board is fixed and the heat dissipation is recorded in real time with a thermal camera. *Figure 3
Experimental Method
・Operate the power module and heat it until it is thermally saturated.
・Comparing temperature changes with and without WE-TGFG sheet and metal plate
- Record and compare temperature rise for each configuration
In this way, we aimed to clearly visualize the heat dissipation effect of the graphite sheet with a simple configuration that simulates actual usage scenarios.
Experimental results: Temperature rise suppression effect confirmed
As a result of the experiment, it was confirmed that a configuration using the WE-TGFG series could suppress temperature rise by approximately 20% compared to a configuration not using the series.
Experimental procedure and results
In this experiment, a 24V 2A output power module board was used and temperature changes were observed with a thermal camera.
■ With heat countermeasures
・ Attach the WE-TGFG to the power module, and then attach a metal plate that resembles a housing to it with a rubber band.
・At this point, the heat becomes saturated and the temperature stops rising at 49.8℃.
■ Without heat protection
- Cut the rubber band and remove the metal plate to eliminate the effect of WE-TGFG
・The temperature then rises again and saturates at 55.8℃
As a result, under the condition of an ambient temperature of 23°C, ⊿T (temperature rise) changed from 26.8°C to 32.8°C, confirming a temperature rise suppression effect of about 6°C (about 20%). In addition, from the thermal camera image, it was visually confirmed that the heat was not concentrated in one point, but was diffused over a wide area.
Visualization of the experiment and temperature changes
In this experiment, in addition to the numerical data from the temperature sensor, we also visualized the heat distribution using a thermal camera. You can watch a 2-minute video to see how the heat actually diffuses and how the WE-TGFG works.
The video below shows the experiment and a real-time record of temperature changes. You can visually confirm the temperature changes with and without thermal countermeasures, as well as the difference in heat distribution using a thermal camera.
Summary: Potential for graphite sheets to combat heat
Through this experiment, it was confirmed that Würth Elektronik's graphite thermal sheet "WE-TGFG series" is able to suppress temperature rise by approximately 6°C (approximately 20%) even in an environment that mimics an actual housing structure.
In particular, the following points became clear:
- Taking advantage of its high thermal conductivity and flexibility, the housing can be used as a heat dissipation path
・Can be used in small spaces and with complex structures
・By adding this to conventional heat dissipation measures, it is expected that temperature rise will be further suppressed.
This shows that the use of graphite sheets is a realistic option as a simple and effective complementary measure for heat problems that cannot be dealt with by circuit design alone. In the future, we hope to verify the effectiveness of the WE-TGFG series in a wider variety of case structures and heat generation conditions, thereby broadening the range of heat countermeasures in product design.
Inquiry / Quotation
If you would like to know more about Würth Elektronik's thermal management components, please contact us using the information below.
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